Effect of bump height on the strain variation during the thermal cycling test of ACA flip-chip joints

Flip chip joining using anisotropically conductive adhesive (ACA) has become a very attractive technique for electronics packaging. Many factors can influence the reliability of the ACA flip-chip joint. Bump height, is one of these factors. In this work, the strain development during the thermal cyc...

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Bibliographic Details
Published in:IEEE transactions on components and packaging technologies 2000-09, Vol.23 (3), p.447-451
Main Authors: Pinardi, K., Lai, Z., Vogel, D., Yi Lan Kang, Liu, J., Liu, S., Haug, R., Willander, M.
Format: Article
Language:English
Subjects:
Adhesives
Anisotropic magnetoresistance
Anisotropy
Bonding
Capacitive sensors
Chips
Conductive adhesives
Electronic equipment testing
Electronic packaging thermal management
Electronics packaging
Joining
Joining materials
Mathematical analysis
Packaging
Production engineering
Strain
Thermal conductivity
Thermal cycling tests
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Summary:Flip chip joining using anisotropically conductive adhesive (ACA) has become a very attractive technique for electronics packaging. Many factors can influence the reliability of the ACA flip-chip joint. Bump height, is one of these factors. In this work, the strain development during the thermal cycling test of flip-chip joining with different bump heights was studied. The effect of bump height is significant in the interface between the bumps and the pads. Bigger volume area of high strain is found for higher bump in the interface between the bumps and the pads. Our calculations show that there is practically no effect of the bump height on the strain variation in the bumps and in the pads.
ISSN:1521-3331
1557-9972
DOI:10.1109/6144.868843