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Nickel precipitation in large-diameter Czochralski silicon

In comparison with small-diameter (4 in), nickel precipitation in large-diameter (8 in) Czochralski silicon (Cz–Si) under air-cooling or slow-cooling was investigated by scanning infrared microscopy (SIRM) and optical microscopy. It was found that a nickel precipitate-free zone with a thickness of 2...

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Published in:Physica. B, Condensed matter Condensed matter, 2004-02, Vol.344 (1), p.407-412
Main Authors: Xi, Zhenqiang, Yang, Deren, Chen, Jun, Que, Duanlin, Moeller, H.J.
Format: Article
Language:English
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Summary:In comparison with small-diameter (4 in), nickel precipitation in large-diameter (8 in) Czochralski silicon (Cz–Si) under air-cooling or slow-cooling was investigated by scanning infrared microscopy (SIRM) and optical microscopy. It was found that a nickel precipitate-free zone with a thickness of 250 μm near the surface formed in the specimen of small-diameter Cz–Si annealed at 1100°C under air-cooling, while no nickel precipitates could be observed under slow-cooling. However, nickel precipitates could be found in all the specimens of large-diameter Cz–Si annealed at 1100°C despite different cooling rates. These results indicate that nickel precipitation depends not only on the cooling rate but also intrinsic defects or their complexes in Cz–Si. Finally, the mechanism of nickel precipitation in larger-diameter Cz–Si is discussed.
ISSN:0921-4526
1873-2135
DOI:10.1016/j.physb.2003.10.020