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New type of plasma reactor for thin film deposition: magnetron plasma process assisted by microwaves to ionise sputtered vapour

A new type of plasma reactor for thin film deposition has been designed: a magnetron-sputtering device assisted by microwave applicators to ionise the sputtered vapour of the magnetron. Ionizing the vapour has several advantages: improvement of the film quality, deposition on substrates with complex...

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Published in:Surface & coatings technology 2004-02, Vol.179 (2), p.176-181
Main Authors: Boisse-Laporte, C., Leroy, O., de Poucques, L., Agius, B., Bretagne, J., Hugon, M.C., Teulé-Gay, L., Touzeau, M.
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cited_by cdi_FETCH-LOGICAL-c405t-bb660713d27b3889a1c8fc5966e07507b0d5104d70e419f46ae81a67b3272b393
cites cdi_FETCH-LOGICAL-c405t-bb660713d27b3889a1c8fc5966e07507b0d5104d70e419f46ae81a67b3272b393
container_end_page 181
container_issue 2
container_start_page 176
container_title Surface & coatings technology
container_volume 179
creator Boisse-Laporte, C.
Leroy, O.
de Poucques, L.
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Bretagne, J.
Hugon, M.C.
Teulé-Gay, L.
Touzeau, M.
description A new type of plasma reactor for thin film deposition has been designed: a magnetron-sputtering device assisted by microwave applicators to ionise the sputtered vapour of the magnetron. Ionizing the vapour has several advantages: improvement of the film quality, deposition on substrates with complex shapes, enhancement and control of the reactivity. The reactor consists of a planar rectangular magnetron cathode (22 cm×9 cm) and of two coaxial-type microwave applicators located perpendicularly to the substrate–magnetron axis, on both sides of the sputtered vapour flow. This reactor can operate on a wide pressure range: from 0.2 to 60 Pa. Several in-situ diagnostics have been performed to characterise the process in argon gas with chromium and titanium targets. Electron density of the order of 10 11–10 12 cm −3 and electron temperature of 1.5–2 eV were measured in the microwave plasma by a cylindrical Langmuir probe; emission of metallic ions (Cr +, Ti +) was clearly identified when the microwave plasma is turned on; concentration of Cr or Ti atoms was measured by absorption spectroscopy, a decrease of this concentration is observed when the microwave power is increased. Characterisation of thin titanium films was performed ex-situ by Rutherford backscattering spectroscopy (RBS) for Ti content and nuclear reaction analysis (NRA) for oxygen contamination. Film density was deduced from RBS and NRA measurements and X-ray reflectometry. Oxygen contamination in the film is clearly decreased when microwave plasma is turned on and with a bias applied to the substrate.
doi_str_mv 10.1016/S0257-8972(03)00856-9
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1879-3347
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source Elsevier
subjects Exact sciences and technology
Magnetron discharge
Microwave discharge
Optical spectroscopy
PAPVD
Physics
Physics of gases, plasmas and electric discharges
Physics of plasmas and electric discharges
Plasma applications
Sputtering
Thin film deposition
title New type of plasma reactor for thin film deposition: magnetron plasma process assisted by microwaves to ionise sputtered vapour
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