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New type of plasma reactor for thin film deposition: magnetron plasma process assisted by microwaves to ionise sputtered vapour
A new type of plasma reactor for thin film deposition has been designed: a magnetron-sputtering device assisted by microwave applicators to ionise the sputtered vapour of the magnetron. Ionizing the vapour has several advantages: improvement of the film quality, deposition on substrates with complex...
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Published in: | Surface & coatings technology 2004-02, Vol.179 (2), p.176-181 |
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container_issue | 2 |
container_start_page | 176 |
container_title | Surface & coatings technology |
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creator | Boisse-Laporte, C. Leroy, O. de Poucques, L. Agius, B. Bretagne, J. Hugon, M.C. Teulé-Gay, L. Touzeau, M. |
description | A new type of plasma reactor for thin film deposition has been designed: a magnetron-sputtering device assisted by microwave applicators to ionise the sputtered vapour of the magnetron. Ionizing the vapour has several advantages: improvement of the film quality, deposition on substrates with complex shapes, enhancement and control of the reactivity. The reactor consists of a planar rectangular magnetron cathode (22 cm×9 cm) and of two coaxial-type microwave applicators located perpendicularly to the substrate–magnetron axis, on both sides of the sputtered vapour flow. This reactor can operate on a wide pressure range: from 0.2 to 60 Pa. Several in-situ diagnostics have been performed to characterise the process in argon gas with chromium and titanium targets. Electron density of the order of 10
11–10
12 cm
−3 and electron temperature of 1.5–2 eV were measured in the microwave plasma by a cylindrical Langmuir probe; emission of metallic ions (Cr
+, Ti
+) was clearly identified when the microwave plasma is turned on; concentration of Cr or Ti atoms was measured by absorption spectroscopy, a decrease of this concentration is observed when the microwave power is increased. Characterisation of thin titanium films was performed ex-situ by Rutherford backscattering spectroscopy (RBS) for Ti content and nuclear reaction analysis (NRA) for oxygen contamination. Film density was deduced from RBS and NRA measurements and X-ray reflectometry. Oxygen contamination in the film is clearly decreased when microwave plasma is turned on and with a bias applied to the substrate. |
doi_str_mv | 10.1016/S0257-8972(03)00856-9 |
format | article |
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11–10
12 cm
−3 and electron temperature of 1.5–2 eV were measured in the microwave plasma by a cylindrical Langmuir probe; emission of metallic ions (Cr
+, Ti
+) was clearly identified when the microwave plasma is turned on; concentration of Cr or Ti atoms was measured by absorption spectroscopy, a decrease of this concentration is observed when the microwave power is increased. Characterisation of thin titanium films was performed ex-situ by Rutherford backscattering spectroscopy (RBS) for Ti content and nuclear reaction analysis (NRA) for oxygen contamination. Film density was deduced from RBS and NRA measurements and X-ray reflectometry. Oxygen contamination in the film is clearly decreased when microwave plasma is turned on and with a bias applied to the substrate.</description><identifier>ISSN: 0257-8972</identifier><identifier>EISSN: 1879-3347</identifier><identifier>DOI: 10.1016/S0257-8972(03)00856-9</identifier><identifier>CODEN: SCTEEJ</identifier><language>eng</language><publisher>Lausanne: Elsevier B.V</publisher><subject>Exact sciences and technology ; Magnetron discharge ; Microwave discharge ; Optical spectroscopy ; PAPVD ; Physics ; Physics of gases, plasmas and electric discharges ; Physics of plasmas and electric discharges ; Plasma applications ; Sputtering ; Thin film deposition</subject><ispartof>Surface & coatings technology, 2004-02, Vol.179 (2), p.176-181</ispartof><rights>2003 Elsevier B.V.</rights><rights>2004 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c405t-bb660713d27b3889a1c8fc5966e07507b0d5104d70e419f46ae81a67b3272b393</citedby><cites>FETCH-LOGICAL-c405t-bb660713d27b3889a1c8fc5966e07507b0d5104d70e419f46ae81a67b3272b393</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,777,781,27905,27906</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=15539115$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Boisse-Laporte, C.</creatorcontrib><creatorcontrib>Leroy, O.</creatorcontrib><creatorcontrib>de Poucques, L.</creatorcontrib><creatorcontrib>Agius, B.</creatorcontrib><creatorcontrib>Bretagne, J.</creatorcontrib><creatorcontrib>Hugon, M.C.</creatorcontrib><creatorcontrib>Teulé-Gay, L.</creatorcontrib><creatorcontrib>Touzeau, M.</creatorcontrib><title>New type of plasma reactor for thin film deposition: magnetron plasma process assisted by microwaves to ionise sputtered vapour</title><title>Surface & coatings technology</title><description>A new type of plasma reactor for thin film deposition has been designed: a magnetron-sputtering device assisted by microwave applicators to ionise the sputtered vapour of the magnetron. Ionizing the vapour has several advantages: improvement of the film quality, deposition on substrates with complex shapes, enhancement and control of the reactivity. The reactor consists of a planar rectangular magnetron cathode (22 cm×9 cm) and of two coaxial-type microwave applicators located perpendicularly to the substrate–magnetron axis, on both sides of the sputtered vapour flow. This reactor can operate on a wide pressure range: from 0.2 to 60 Pa. Several in-situ diagnostics have been performed to characterise the process in argon gas with chromium and titanium targets. Electron density of the order of 10
11–10
12 cm
−3 and electron temperature of 1.5–2 eV were measured in the microwave plasma by a cylindrical Langmuir probe; emission of metallic ions (Cr
+, Ti
+) was clearly identified when the microwave plasma is turned on; concentration of Cr or Ti atoms was measured by absorption spectroscopy, a decrease of this concentration is observed when the microwave power is increased. Characterisation of thin titanium films was performed ex-situ by Rutherford backscattering spectroscopy (RBS) for Ti content and nuclear reaction analysis (NRA) for oxygen contamination. Film density was deduced from RBS and NRA measurements and X-ray reflectometry. Oxygen contamination in the film is clearly decreased when microwave plasma is turned on and with a bias applied to the substrate.</description><subject>Exact sciences and technology</subject><subject>Magnetron discharge</subject><subject>Microwave discharge</subject><subject>Optical spectroscopy</subject><subject>PAPVD</subject><subject>Physics</subject><subject>Physics of gases, plasmas and electric discharges</subject><subject>Physics of plasmas and electric discharges</subject><subject>Plasma applications</subject><subject>Sputtering</subject><subject>Thin film deposition</subject><issn>0257-8972</issn><issn>1879-3347</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2004</creationdate><recordtype>article</recordtype><recordid>eNqFkEFv1DAQhS0EEkvhJyD5AoJD6DiO45gLqipokar2AJwtx5mAURIHj3erPfHX8XYLHHsYzeV77808xl4KeCdAtKdfoFa66oyu34B8C9CptjKP2EZ02lRSNvox2_xDnrJnRD8BQGjTbNjva7zleb8ijyNfJ0ez4wmdzzHxsUz-ERY-hmnmA66RQg5xec9n933BnOLyV7Km6JGIO6JAGQfe7_kcfIq3bofEc-RFFwg5rducMRVi59a4Tc_Zk9FNhC_u9wn79unj1_PL6urm4vP52VXlG1C56vu2BS3kUOtedp1xwnejV6ZtEbQC3cOgBDSDBmyEGZvWYSdcW-Ba17008oS9PvqWS39tkbKdA3mcJrdg3JKtu7rYNnUB1REsxxMlHO2awuzS3gqwh7rtXd320KUFae_qtoeAV_cBjrybxuQWH-i_WClphFCF-3DksHy7C5gs-YCLxyEk9NkOMTyQ9Add75ZL</recordid><startdate>20040223</startdate><enddate>20040223</enddate><creator>Boisse-Laporte, C.</creator><creator>Leroy, O.</creator><creator>de Poucques, L.</creator><creator>Agius, B.</creator><creator>Bretagne, J.</creator><creator>Hugon, M.C.</creator><creator>Teulé-Gay, L.</creator><creator>Touzeau, M.</creator><general>Elsevier B.V</general><general>Elsevier</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20040223</creationdate><title>New type of plasma reactor for thin film deposition: magnetron plasma process assisted by microwaves to ionise sputtered vapour</title><author>Boisse-Laporte, C. ; Leroy, O. ; de Poucques, L. ; Agius, B. ; Bretagne, J. ; Hugon, M.C. ; Teulé-Gay, L. ; Touzeau, M.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c405t-bb660713d27b3889a1c8fc5966e07507b0d5104d70e419f46ae81a67b3272b393</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2004</creationdate><topic>Exact sciences and technology</topic><topic>Magnetron discharge</topic><topic>Microwave discharge</topic><topic>Optical spectroscopy</topic><topic>PAPVD</topic><topic>Physics</topic><topic>Physics of gases, plasmas and electric discharges</topic><topic>Physics of plasmas and electric discharges</topic><topic>Plasma applications</topic><topic>Sputtering</topic><topic>Thin film deposition</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Boisse-Laporte, C.</creatorcontrib><creatorcontrib>Leroy, O.</creatorcontrib><creatorcontrib>de Poucques, L.</creatorcontrib><creatorcontrib>Agius, B.</creatorcontrib><creatorcontrib>Bretagne, J.</creatorcontrib><creatorcontrib>Hugon, M.C.</creatorcontrib><creatorcontrib>Teulé-Gay, L.</creatorcontrib><creatorcontrib>Touzeau, M.</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Surface & coatings technology</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Boisse-Laporte, C.</au><au>Leroy, O.</au><au>de Poucques, L.</au><au>Agius, B.</au><au>Bretagne, J.</au><au>Hugon, M.C.</au><au>Teulé-Gay, L.</au><au>Touzeau, M.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>New type of plasma reactor for thin film deposition: magnetron plasma process assisted by microwaves to ionise sputtered vapour</atitle><jtitle>Surface & coatings technology</jtitle><date>2004-02-23</date><risdate>2004</risdate><volume>179</volume><issue>2</issue><spage>176</spage><epage>181</epage><pages>176-181</pages><issn>0257-8972</issn><eissn>1879-3347</eissn><coden>SCTEEJ</coden><abstract>A new type of plasma reactor for thin film deposition has been designed: a magnetron-sputtering device assisted by microwave applicators to ionise the sputtered vapour of the magnetron. Ionizing the vapour has several advantages: improvement of the film quality, deposition on substrates with complex shapes, enhancement and control of the reactivity. The reactor consists of a planar rectangular magnetron cathode (22 cm×9 cm) and of two coaxial-type microwave applicators located perpendicularly to the substrate–magnetron axis, on both sides of the sputtered vapour flow. This reactor can operate on a wide pressure range: from 0.2 to 60 Pa. Several in-situ diagnostics have been performed to characterise the process in argon gas with chromium and titanium targets. Electron density of the order of 10
11–10
12 cm
−3 and electron temperature of 1.5–2 eV were measured in the microwave plasma by a cylindrical Langmuir probe; emission of metallic ions (Cr
+, Ti
+) was clearly identified when the microwave plasma is turned on; concentration of Cr or Ti atoms was measured by absorption spectroscopy, a decrease of this concentration is observed when the microwave power is increased. Characterisation of thin titanium films was performed ex-situ by Rutherford backscattering spectroscopy (RBS) for Ti content and nuclear reaction analysis (NRA) for oxygen contamination. Film density was deduced from RBS and NRA measurements and X-ray reflectometry. Oxygen contamination in the film is clearly decreased when microwave plasma is turned on and with a bias applied to the substrate.</abstract><cop>Lausanne</cop><pub>Elsevier B.V</pub><doi>10.1016/S0257-8972(03)00856-9</doi><tpages>6</tpages></addata></record> |
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subjects | Exact sciences and technology Magnetron discharge Microwave discharge Optical spectroscopy PAPVD Physics Physics of gases, plasmas and electric discharges Physics of plasmas and electric discharges Plasma applications Sputtering Thin film deposition |
title | New type of plasma reactor for thin film deposition: magnetron plasma process assisted by microwaves to ionise sputtered vapour |
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