High-performance inter-PCB connectors: analysis of EMI characteristics

Electromagnetic interference (EMI) coupling associated with inter-board connection is investigated. Two experimental techniques, based on |S/sub 21/| measurements, including both common-mode current and near-field measurements, are reported. Both methods, as well as finite difference time domain (FD...

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Bibliographic Details
Published in:IEEE transactions on electromagnetic compatibility 2002-02, Vol.44 (1), p.165-174
Main Authors: Xiaoning Ye, Drewniak, J.L., Nadolny, J., Hockanson, D.M.
Format: Article
Language:English
Subjects:
Applied sciences
Connectors
Electromagnetic compatibility
Electromagnetic interference
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Exact sciences and technology
Information, signal and communications theory
Joining
Joints
Printed circuits
Telecommunications and information theory
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Summary:Electromagnetic interference (EMI) coupling associated with inter-board connection is investigated. Two experimental techniques, based on |S/sub 21/| measurements, including both common-mode current and near-field measurements, are reported. Both methods, as well as finite difference time domain (FDTD) modeling, were used as experimental and numerical tools for inter-printed-circuit-board (inter-PCB) connector evaluation. The EMI performance of a lab-constructed stacked-card connector, and a commercially available module-on-backplane connector were studied. EMI characteristics of the connectors are demonstrated by investigating a few aspects of the design: type of shield/ground blade for signal return, number and length of ground pins, signal pin designation, etc. Good agreement is achieved between the measurements and the FDTD modeled results.
ISSN:0018-9375
1558-187X
DOI:10.1109/15.990723