A Study on the Micro Machining of Si Wafer Using Surface Chemical Reaction

• Published in: Key engineering materials 2004-01, Vol.257-258, p.459-464
• Main Authors: Jeong, Hae Do, Park, J.M.
• Format: Article
• Language: English
• ISSN: 1013-9826; 1662-9795; 1662-9795
• DOI: 10.4028/www.scientific.net/KEM.257-258.459

The focus of this study is the development of the chemical mechanical micro machining of silicon material, which shows characteristics of brittle fracture during mechanical machining. Although it is possible to make a ductile regime removal of the brittle materials by way of a delicate and highly accurate depth control method, the control of the critical load as well as the nature of the brittle fracture make it difficult to achieve desired shapes and structures. Therefore, the chemical energy assisted method for the mechanical micro machining of the brittle material is proposed to enhance the machinability of silicon material through the formation of a hydrated layer, which dramatically reduces brittle fracture and enhances surface quality of the machined surface. In the experiment, potassium hydroxide (KOH) was used as a chemical solution for the formation of the hydrated layer on the silicon material. The mechanical characteristics of the reacted layer were analyzed by scratching, nano indentation, and friction tests. The results are presented.