Microstructural variations with uranium compound doping of Bi-Sr-Ca-Cu-O/Ag superconducting tapes

Doping of Bi-Sr-Ca-Cu-O based silver sheathed superconducting tapes (BSCCO/Ag) with various uranium compounds was carried out. This work was aimed at minimising the detrimental effects of doping to allow for later irradiation and fission to create columnar defects for strong flux pinning. The effect...

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Bibliographic Details
Published in:IEEE transactions on applied superconductivity 2001-03, Vol.11 (1), p.3964-3967
Main Authors: Milliken, D.A., Ahn, J.H., Dou, S.X.
Format: Article
Language:English
Subjects:
Applied sciences
Bismuth compounds
Condensed matter: electronic structure, electrical, magnetic, and optical properties
Current density
Degradation
Dispersion
Doping
Effects of crystal defects, doping and substitution
Electrical engineering. Electrical power engineering
Exact sciences and technology
Flux pinning
Materials
Microstructure
Physics
Silver
Spectroscopy
Strontium
Superconducting films
Superconducting tapes
Superconductivity
Transition temperature variations
Uranium compounds
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Summary:Doping of Bi-Sr-Ca-Cu-O based silver sheathed superconducting tapes (BSCCO/Ag) with various uranium compounds was carried out. This work was aimed at minimising the detrimental effects of doping to allow for later irradiation and fission to create columnar defects for strong flux pinning. The effects on the transport current density of BSCCO/Ag of doping with a variety of uranium compounds up to 2 at% was determined. Microstructural changes due to the doping were investigated. Removal of elements from the BSCCO matrix by uranium compound dopants was studied by energy dispersive spectroscopy. It was found that UCa/sub 1.5/Sr/sub 1.5/O/sub 6/ least degraded electrical performance and microstructure, as it removed the least elements from the matrix. It would appear that UCa/sub 1.5/Sr/sub 1.5/O/sub 6/ most closely approximates an ideal BSCCO compatible uranium compound, but it still removes some amount of copper.
ISSN:1051-8223
1558-2515
DOI:10.1109/77.919949