XPS and atomic force microscopy analyses of thin Au and Cu films on Pd

The surface properties of bimetallic systems have been studied recently due to possible applications in different areas, such as electrochemistry, magnetism, and catalysis. Understanding of the atomic and electronic structures is crucial for designing metallic devices. In this work, thin films of go...

Full description

Saved in:
Bibliographic Details
Published in:Surface and interface analysis 2004-08, Vol.36 (8), p.931-934
Main Authors: Maluf, S. S., Gobbi, A. L., Paulin-Filho, P. I., Nascente, P. A. P.
Format: Article
Language:English
Subjects:
AFM
Condensed matter: electronic structure, electrical, magnetic, and optical properties
Condensed matter: structure, mechanical and thermal properties
copper
Cross-disciplinary physics: materials science
rheology
Exact sciences and technology
gold
palladium
Physics
thin film
XPS
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:The surface properties of bimetallic systems have been studied recently due to possible applications in different areas, such as electrochemistry, magnetism, and catalysis. Understanding of the atomic and electronic structures is crucial for designing metallic devices. In this work, thin films of gold and copper were grown on a polycrystalline palladium substrate by sputtering. For both films, the thickness was estimated to be 10 nm. The morphology of the films was investigated by atomic force microscopy (AFM). XPS was employed in order to verify the possibility of alloy formation. Oxide formation was observed for the Cu film, but not for the Au film. The copper oxide (CuO) was removed by argon ion sputtering. Alloying was not observed in the Au/Pd or Cu/Pd films. Copyright © 2004 John Wiley & Sons, Ltd.
ISSN:0142-2421
1096-9918
DOI:10.1002/sia.1803