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Relationship between IBICC imaging and SEU in CMOS ICs

Ion-beam-induced charge-collection imaging (IBICC) has been used to study the single event upset (SEU) mechanisms of the Sandia TA670 16-kb static random-access memory (SRAM). Quantitative charge-collection spectra from known regions of the memory cell have been derived using this technique. For 2.4...

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Bibliographic Details
Published in:IEEE Transactions on Nuclear Science (Institute of Electrical and Electronics Engineers); (United States) 1993-12, Vol.40 (6), p.1787-1794
Main Authors: Sexton, F.W., Horn, K.M., Doyle, B.L., Laird, J.S., Cholewa, M., Saint, A., Legge, G.J.F.
Format: Article
Language:English
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Summary:Ion-beam-induced charge-collection imaging (IBICC) has been used to study the single event upset (SEU) mechanisms of the Sandia TA670 16-kb static random-access memory (SRAM). Quantitative charge-collection spectra from known regions of the memory cell have been derived using this technique. For 2.4-MeV He ions at normal incidence, charge collection depth for a reverse-biased p+ drain strike is estimated to be 4.8+or-0.4 mu m. Heavy-ion strikes to the reverse-biased p-well result in nearly complete collection of deposited charge to a depth of 5.5+or-0.5 mu m. A charge amplification effect in the n-on drain is identified and is due to either bipolar amplification or a shunt effect in the parasitic vertical npn bipolar transistor associated with the n+/n substrate, p-well, and n+drain. This effect is present only when the n+drain is at 0 V bias. When coupled with previous SEU-imaging, these results strongly suggest that the dominant SEU mechanism in this SRAM is a heavy-ion strike to the n-on transistor drain.< >
ISSN:0018-9499
1558-1578
DOI:10.1109/23.273478