Residual stress effects on plastic deformation and interfacial fracture in thin-film structures

Residual stress in ductile thin films is shown to significantly affect the extent of film plasticity and interfacial fracture energy during debonding in thin-film structures. Specifically, the interfacial fracture resistance of a TaN/SiO 2 interface in a thin-film structure containing an adjacent du...

Full description

Saved in:
Bibliographic Details
Published in:Acta materialia 2005-04, Vol.53 (7), p.1955-1961
Main Authors: Litteken, Christopher S., Strohband, Sven, Dauskardt, Reinhold H.
Format: Article
Language:English
Subjects:
Applied sciences
Exact sciences and technology
Fracture
Fractures
Internal stresses
Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology
Metals. Metallurgy
Plastic deformation
Thin films
Toughness
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Residual stress in ductile thin films is shown to significantly affect the extent of film plasticity and interfacial fracture energy during debonding in thin-film structures. Specifically, the interfacial fracture resistance of a TaN/SiO 2 interface in a thin-film structure containing an adjacent ductile Cu film with varying residual stress is compared to predictions from computational models. The fracture energy of the TaN/SiO 2 interface increased by 50% for structures containing a Cu film in compression compared to similar structures with the film in tension. The effect of residual stress on interfacial adhesion is rationalized in terms of the onset of yielding within the Cu film, which affects the contribution from plastic energy dissipation to the total interface fracture energy.
ISSN:1359-6454
1873-2453
DOI:10.1016/j.actamat.2005.01.005