Determination of dielectric and calorimetric properties in the cure reaction of two thermosets by dielectric analysis and differential scanning calorimetry

Dielectric analysis and differential scanning calorimetry were used to study the cure reaction of an epoxy resin (the diglycidyl ether of bisphenol A (DGEBA) (n = 0)) and two curing agents, ie 1,2‐diamine cyclohexane (1,2‐DCH) and m‐xylylenediamine (m‐XDA). Various dielectric properties, such as the...

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Bibliographic Details
Published in:Polymer international 2005-11, Vol.54 (11), p.1484-1489
Main Authors: NUNEZ, Lisardo, GOMEZ-BARREIRO, S, GRACIA-FERNANDEZ, C. A
Format: Article
Language:English
Subjects:
Applied sciences
Chemical properties
dielectric analysis
differential scanning calorimetry
Exact sciences and technology
Polymer industry, paints, wood
Properties and testing
relaxed permittivity
Technology of polymers
thermoset
unrelaxed permittivity
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Summary:Dielectric analysis and differential scanning calorimetry were used to study the cure reaction of an epoxy resin (the diglycidyl ether of bisphenol A (DGEBA) (n = 0)) and two curing agents, ie 1,2‐diamine cyclohexane (1,2‐DCH) and m‐xylylenediamine (m‐XDA). Various dielectric properties, such as the relaxed permittivity, unrelaxed permittivity and dipole strength, were determined as a function of the curing time, temperature and conversion. The dielectric curing properties observed were related to geometric and energetic aspects of the samples. Analysis of the results shows that the relaxed permittivity and dipole strength are higher for the system DGEBA (n = 0)/1,2‐DCH than for the system DGEBA (n = 0)/m‐XDA. Copyright © 2005 Society of Chemical Industry
ISSN:0959-8103
1097-0126
DOI:10.1002/pi.1872