Three-dimensional high-frequency distribution networks. II. Packaging and integration

This paper describes the implementation and packaging of the components, described in Part I of this paper, to realize a three-dimensional W-band distribution network.

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Bibliographic Details
Published in:IEEE transactions on microwave theory and techniques 2000-10, Vol.48 (10), p.1643-1651
Main Authors: Henderson, R.M., Herrick, K.J., Weller, T.M., Robertson, S.V., Kihm, R.T., Katehi, L.P.B.
Format: Article
Language:English
Subjects:
Distributed parameter circuits
Frequency
Laboratories
Micromachining
Microwave circuits
Microwave devices
Microwaves
Networks
Packaging
Performance loss
Power generation
Power transmission lines
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Description
Summary:This paper describes the implementation and packaging of the components, described in Part I of this paper, to realize a three-dimensional W-band distribution network.
ISSN:0018-9480
1557-9670
DOI:10.1109/22.873891