The effects of triple junctions and grain boundaries on hardness and Young’s modulus in nanostructured Ni–P

Hardness and Young’s modulus were measured on a series of nanocrystalline Ni–P samples. With decreasing grain size, a transition from regular to inverse Hall–Petch relationship and a reduction in Young’s modulus at the smallest grain sizes was observed, which can be attributed to grain boundary and...

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Bibliographic Details
Published in:Scripta materialia 2003-03, Vol.48 (6), p.825-830
Main Authors: Zhou, Y, Erb, U, Aust, K.T, Palumbo, G
Format: Article
Language:English
Subjects:
Applied sciences
Cross-disciplinary physics: materials science
rheology
Deformation, plasticity, and creep
Electroplating
Exact sciences and technology
Interfaces
Materials science
Mechanical properties
Metals. Metallurgy
Nanocrystalline materials
Nanoindentation
Physics
Treatment of materials and its effects on microstructure and properties
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Summary:Hardness and Young’s modulus were measured on a series of nanocrystalline Ni–P samples. With decreasing grain size, a transition from regular to inverse Hall–Petch relationship and a reduction in Young’s modulus at the smallest grain sizes was observed, which can be attributed to grain boundary and triple junction effect.
ISSN:1359-6462
1872-8456
DOI:10.1016/S1359-6462(02)00511-0