Reduction of exchange coupling and enhancement of coercivity of L10 FePt(001) films by Cu top layer diffusion

Cu top layer diffusion was used to reduce the exchange coupling of FePt magnetic grains since diffusion along grain boundaries is easier than bulk diffusion. After the deposition of 2 and 4 nm Cu layer on FePt film at 350 DDGC the slope of the out-of-plane M-H loops decreased and the out-of-plane co...

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Bibliographic Details
Published in:Thin solid films 2006-05, Vol.505 (1-2), p.81-84
Main Authors: LIM, B. C, CHEN, J. S, YIN, J. H
Format: Article
Language:English
Subjects:
Condensed matter: electronic structure, electrical, magnetic, and optical properties
Cross-disciplinary physics: materials science
rheology
Deposition by sputtering
Exact sciences and technology
Exchange and superexchange interactions
Magnetic properties and materials
Magnetically ordered materials: other intrinsic properties
Materials science
Methods of deposition of films and coatings
film growth and epitaxy
Physics
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Summary:Cu top layer diffusion was used to reduce the exchange coupling of FePt magnetic grains since diffusion along grain boundaries is easier than bulk diffusion. After the deposition of 2 and 4 nm Cu layer on FePt film at 350 DDGC the slope of the out-of-plane M-H loops decreased and the out-of-plane coercivity increased from 3158 Oe to 6050 Oe, suggesting the exchange coupling decreases. The magnetisation reversal mechanism changed from the domain wall motion to the rotation mode with the deposition of Cu top layers. Moment decay measurements based on the Sharrock formula were made to evaluate the thermal stability factor KuV*/kBT and the magnetic switching volume V*. V* was reduced by increased Cu top layer which further confirmed the reduction of exchange coupling.
ISSN:0040-6090
1879-2731
DOI:10.1016/j.tsf.2005.10.008