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Schottky-barrier S/D MOSFETs with high-k gate dielectrics and metal-gate electrode

This letter presents a low-temperature process to fabricate Schottky-barrier silicide source/drain transistors (SSDTs) with high-/spl kappa/ gate dielectric and metal gate. For p-channel SSDTs (P-SSDT) using PtSi sourece/drain (S/D) , excellent electrical performance of I/sub on//I/sub off//spl sim/...

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Published in:IEEE electron device letters 2004-05, Vol.25 (5), p.268-270
Main Authors: Shiyang Zhu, Yu, H.Y., Whang, S.J., Chen, J.H., Chen Shen, Chunxiang Zhu, Lee, S.J., Li, M.F., Chan, D.S.H., Yoo, W.J., Du, A., Tung, C.H., Singh, J., Chin, A., Kwong, D.L.
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container_end_page 270
container_issue 5
container_start_page 268
container_title IEEE electron device letters
container_volume 25
creator Shiyang Zhu
Yu, H.Y.
Whang, S.J.
Chen, J.H.
Chen Shen
Chunxiang Zhu
Lee, S.J.
Li, M.F.
Chan, D.S.H.
Yoo, W.J.
Du, A.
Tung, C.H.
Singh, J.
Chin, A.
Kwong, D.L.
description This letter presents a low-temperature process to fabricate Schottky-barrier silicide source/drain transistors (SSDTs) with high-/spl kappa/ gate dielectric and metal gate. For p-channel SSDTs (P-SSDT) using PtSi sourece/drain (S/D) , excellent electrical performance of I/sub on//I/sub off//spl sim/10/sup 7/-10/sup 8/ and subthreshold slope of 66 mV/dec have been achieved. For n-channel SSDTs (N-SSDTs) using DySi/sub 2-x/ S/D , I/sub on//I/sub off/ can reach /spl sim/10/sup 5/ at V/sub ds/ of 0.2 V with two subthreshold slopes of 80 and 340 mV/dec. The low-temperature process relaxes the thermal budget of high-/spl kappa/ dielectric and metal-gate materials to be used in the future generation CMOS technology.
doi_str_mv 10.1109/LED.2004.826569
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For p-channel SSDTs (P-SSDT) using PtSi sourece/drain (S/D) , excellent electrical performance of I/sub on//I/sub off//spl sim/10/sup 7/-10/sup 8/ and subthreshold slope of 66 mV/dec have been achieved. For n-channel SSDTs (N-SSDTs) using DySi/sub 2-x/ S/D , I/sub on//I/sub off/ can reach /spl sim/10/sup 5/ at V/sub ds/ of 0.2 V with two subthreshold slopes of 80 and 340 mV/dec. The low-temperature process relaxes the thermal budget of high-/spl kappa/ dielectric and metal-gate materials to be used in the future generation CMOS technology.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/LED.2004.826569</doi><tpages>3</tpages></addata></record>
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source IEEE Electronic Library (IEL) Journals
subjects Annealing
Budgeting
CMOS
CMOS technology
Dielectrics
Drains
Electrodes
Gates
Hafnium oxide
Laboratories
Microelectronics
MOSFETs
Silicides
Silicon
title Schottky-barrier S/D MOSFETs with high-k gate dielectrics and metal-gate electrode
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