A comparative analysis of interconnection technologies for integrated multilayer inductors

Multilayer aircore inductors fabricated in a range of interconnection technologies which are MCM compatible are presented and compared. These consist of thick-film, low temperature cofired ceramic (LTCC), printed circuit board (PCB) and fine-line plated copper on ceramic (copper plating). From a com...

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Bibliographic Details
Published in:Microelectronics international 1998-04, Vol.15 (1), p.6-10
Main Authors: O' Reilly, Stephen, Flannery, John, O' Donnell, Terence, Muddiman, Andrew, Healy, Gerard, Byrne, Michael, Cian Ó Mathúna, Sean
Format: Article
Language:English
Subjects:
Comparative analysis
Copper
Electronics
Electroplating
Interconnect
Investigations
Planar inductor
Plating
Printed circuit board
Printed circuit boards
Production methods
Research centers
Screen printing
Studies
Technology
Thick film
University colleges
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Summary:Multilayer aircore inductors fabricated in a range of interconnection technologies which are MCM compatible are presented and compared. These consist of thick-film, low temperature cofired ceramic (LTCC), printed circuit board (PCB) and fine-line plated copper on ceramic (copper plating). From a comparison of simulated and measured results, it can be concluded that a predictive design capability has been achieved for inductance and self-resonant frequency (SRF). Modelling of AC resistance and Q requires further investigation.
ISSN:1356-5362
1758-812X
DOI:10.1108/13565369810199059