The effect of embedded Pb on Cu diffusion on Pb/Cu(1 1 1) surface alloys

• Published in: Surface science 2006-05, Vol.600 (9), p.1901-1908
• Main Authors: Anderson, M.L., Bartelt, N.C., Feibelman, P.J., Swartzentruber, B.S., Kellogg, G.L.
• Format: Article
• Language: English
• Subjects: Condensed matter: electronic structure, electrical, magnetic, and optical properties; Condensed matter: structure, mechanical and thermal properties; Copper; Cross-disciplinary physics: materials science; rheology; Density functional calculations; Exact sciences and technology; Lead; Low-energy electron microscopy; Physics; Scanning tunneling microscopy; Self-assembly; Surface diffusion
• ISSN: 0039-6028; 1879-2758
• DOI: 10.1016/j.susc.2006.02.034

We have used scanning tunneling microscopy and low-energy electron microscopy to measure the thermal decay of two-dimensional Cu, Pb-overlayer, and Pb–Cu alloy islands on Pb–Cu(1 1 1) surface alloys. Decay rates covering 6–7 orders of magnitude are accessible by applying the two techniques to the same system. We find that Cu adatom diffusion across the surface alloy is rate-limiting for the decay of both Pb and Pb–Cu islands on the surface alloy and that this rate decreases monotonically with increasing Pb concentration in the alloy. The decrease is attributed to repulsive interactions between Cu adatoms and embedded Pb atoms in the surface alloy. The measured temperature dependences of island decay rates are consistent with first-principles calculations of the Cu binding and diffusion energies related to this “site-blocking” effect.