Fabrication of a micro cryogenic cold stage using MEMS-technology

• Published in: Journal of micromechanics and microengineering 2006-10, Vol.16 (10), p.1919-1925
• Main Authors: Lerou, P P P M, Venhorst, G C F, Berends, C F, Veenstra, T T, Blom, M, Burger, J F, ter Brake, H J M, Rogalla, H
• Format: Article
• Language: English
• Subjects: Applied sciences; Electronics; Exact sciences and technology; Instruments, apparatus, components and techniques common to several branches of physics and astronomy; Mechanical engineering. Machine design; Mechanical instruments, equipment and techniques; Microelectronic fabrication (materials and surfaces technology); Micromechanical devices and systems; Physics; Precision engineering, watch making; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
• ISSN: 0960-1317; 1361-6439
• DOI: 10.1088/0960-1317/16/10/002

This paper describes the design and production process of a variety of reliable micro cryogenic coolers. The different cold stages are based on an optimized design found during a study which was done to maximize the cold-stage effectiveness. Typical cold-stage dimensions are 30 X 2 X 0.5 mm with an expected net cooling power varying from 10 mW to 20 mW at a tip temperature of 96 K. A cold stage consists of a stack of three fusion bonded D263T glass wafers. The production process has 7 lithography steps and roughly 100 process steps. In order to determine the maximum bend, shear and bond stresses inside a 175 mum thick D263T glass wafer, several pressure tests were performed.