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Tactile corpuscle-inspired piezoresistive sensors based on (3-aminopropyl) triethoxysilane-enhanced CNPs/carboxylated MWCNTs/cellulosic fiber composites for textile electronics

[Display omitted] Recently, wearable electronic products and gadgets have developed quickly with the aim of catching up to or perhaps surpassing the ability of human skin to perceive information from the external world, such as pressure and strain. In this study, by first treating the cellulosic fib...

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Published in:Journal of colloid and interface science 2024-04, Vol.660, p.203-214
Main Authors: Guo, Xiaohui, Zhang, Tianxu, Wang, Ziang, Zhang, Huishan, Yan, Zihao, Li, Xianghui, Hong, Weiqiang, Zhang, Anqi, Qian, Zhibin, Zhang, Xinyi, Shu, Yuxin, Wang, Jiahao, Hua, Liangping, Hong, Qi, Zhao, Yunong
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Language:English
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Summary:[Display omitted] Recently, wearable electronic products and gadgets have developed quickly with the aim of catching up to or perhaps surpassing the ability of human skin to perceive information from the external world, such as pressure and strain. In this study, by first treating the cellulosic fiber (modal textile) substrate with (3-aminopropyl) triethoxysilane (APTES) and then covering it with conductive nanocomposites, a bionic corpuscle layer is produced. The sandwich structure of tactile corpuscle-inspired bionic (TCB) piezoresistive sensors created with the layer-by-layer (LBL) technology consists of a pressure-sensitive module (a bionic corpuscle), interdigital electrodes (a bionic sensory nerve), and a PU membrane (a bionic epidermis). The synergistic mechanism of hydrogen bond and coupling agent helps to improve the adhesive properties of conductive materials, and thus improve the pressure sensitive properties. The TCB sensor possesses favorable sensitivity (1.0005 kPa−1), a wide linear sensing range (1700 kPa), and a rapid response time (40 ms). The sensor is expected to be applied in a wide range of possible applications including human movement tracking, wearable detection system, and textile electronics.
ISSN:0021-9797
1095-7103
DOI:10.1016/j.jcis.2024.01.059