Epoxy-Based Copper (Cu) Sintering Pastes for Enhanced Bonding Strength and Preventing Cu Oxidation after Sintering

• Published in: Polymers 2024-01, Vol.16 (3), p.398
• Main Authors: Han, Seong-Ju, Lee, Seungyeon, Jang, Keon-Soo
• Format: Article
• Language: English
• Subjects: Additives; Analysis; Bisphenol A; Bonding strength; Carboxylic acids; Composition; Conductivity; Copper; Epoxy resins; Heat conductivity; Lead; Mechanical properties; Methods; Oxidation resistance; Oxidation-reduction reaction; Oxygen atoms; Pastes; Scanning electron microscopy; Semiconductors; Shear strength; Silicon wafers; Silver; Sintering; Solvents; Temperature; Wire
• ISSN: 2073-4360; 2073-4360
• DOI: 10.3390/polym16030398

The investigation of interconnection technologies is crucial for advancing semiconductor packaging technology. This study delved into the various methods of achieving electrical interconnections, focusing on the sintering process and composition of the epoxy. Although silver (Ag) has traditionally been utilized in the sintering process, its high cost often precludes widespread commercial applications. Copper (Cu) is a promising alternative that offers advantages, such as cost-effectiveness and high thermal and electrical conductivities. However, the mechanical robustness of the oxide layers formed on Cu surfaces results in several challenges. This research addresses these challenges by integrating epoxy, which has advantages such as adhesive capabilities, chemical resistance, and robust mechanical properties. The chemical reactivity of the epoxy was harnessed to both fortify adhesion and inhibit oxide layer formation. However, the optimal sintering performance required considering both the composite composition (20 wt% epoxy) and the specific sintering conditions (pre-heating at 200 °C and sintering at 250 °C). The experimental findings reveal a balance in the incorporation of epoxy (20 wt%) for the desired electrical and mechanical properties. In particular, the bisphenol A epoxy (Da)-containing sintered Cu chip exhibited the highest lab shear strength (35.9 MPa), whereas the sintered Cu chip without epoxy represented the lowest lab shear strength of 2.7 MPa. Additionally, the introduction of epoxy effectively curtailed the onset of oxidation in the sintered Cu chips, further enhancing their durability. For instance, 30 days after sintering, the percentage of oxygen atoms in the Da-containing sintered Cu chip (4.5%) was significantly lower than that in the sintered Cu chip without epoxy (37.6%), emphasizing the role of epoxy in improving Cu oxidation resistance. Similarly, the samples sintered with bisphenol-based epoxy binders exhibited the highest electrical and thermal conductivities after 1 month. This study provides insights into interactions between epoxy, carboxylic acid, solvents, and Cu during sintering and offers a foundation for refining the sintering conditions.