Preparation of high dispersed nickel pastes for thick film electrodes

Ultra-thinning of Ni paste films for BME-MLCC (Base Metal Electrode Multilayered Ceramic Capacitor) internal electrode was investigated. Adding various dispersants, ball-milling powder, and using the pre-dispersion process to improve Ni paste dispersion and properties of the paste electrodes/thick f...

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Bibliographic Details
Published in:Journal of materials science 2006-10, Vol.41 (19), p.6425-6430
Main Authors: IM, D. H, HYUN, S. H, PARK, S. Y, LEE, B. Y, KIM, Y. H
Format: Article
Language:English
Subjects:
Applied sciences
Ball milling
Base metal
Ceramic powders
Dispersants
Dispersion
Dispersions
Electrodes
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Ethyl cellulose
Exact sciences and technology
Materials science
Nickel
Pastes
Sintering (powder metallurgy)
Surface roughness
Thick films
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Summary:Ultra-thinning of Ni paste films for BME-MLCC (Base Metal Electrode Multilayered Ceramic Capacitor) internal electrode was investigated. Adding various dispersants, ball-milling powder, and using the pre-dispersion process to improve Ni paste dispersion and properties of the paste electrodes/thick films, were employed. The paste containing 200 nm sized Ni powders, ethyl cellulose vehicle (η = 2.98 × 104 mPa-s at 0.1 s−1), and Emphos PS-21A as a dispersant proved to be the most desirable candidate. This paste thick film showed the smallest surface roughness (Ra = 0.10 μm and Rmax = 0.97 μm) at a viscosity (η = 2.80 × 105 mPa-s at 0.1 s−1) adaptable to screen-printing. In addition, the Ni paste/thick film had the low sheet resistivity (ρ = 1.11 × 10−4 Ωcm) and an excellent microstructure after sintering at 1,290 °C for 3 h in a 97% N2/3% H2 atmosphere.
ISSN:0022-2461
1573-4803
DOI:10.1007/s10853-006-0715-2