Novel Test Procedure of Tensile Test for MEMS Materials

• Published in: Key engineering materials 2006-01, Vol.321-323, p.136-139
• Main Authors: Park, Jun Hyub, Choa, Sung Hoon, Kim, Yun Jae, Choi, Nam Sup, Myung, Man Sik, Lee, Chang Seung
• Format: Article
• Language: English
• ISSN: 1013-9826; 1662-9795; 1662-9795
• DOI: 10.4028/www.scientific.net/KEM.321-323.136

This paper describes a novel test procedure, new structure of specimen easy to manipulate, align and grip a thin-film and test machine for a tensile and fatigue test. For the proposed specimen, the surroundings of the specimen including the side support strips except for six bridges are etched during the fabrication of the specimen, which in turn makes it possible to cut off easily the specimen from the wafer by minimizing a damage to the test film and also possible to produce the specimen in mass production. For the present specimen, a small hole is made at the grip end and using a small pin for setting the specimen onto the tester, the setting process and alignment of specimen is much easier, compared to the specimen proposed by Sharpe et al. To gain confidence in reliability of testing results, pre-test using the Al-3%Ti is performed, which is widely used in the RF switch and other MEMS devices. Tensile tests are performed, from which tensile strengths of the Al-3%Ti are measured as 343±16.22MPa at 200μm width and 1.1μm thickness.