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Novel Test Procedure of Tensile Test for MEMS Materials
This paper describes a novel test procedure, new structure of specimen easy to manipulate, align and grip a thin-film and test machine for a tensile and fatigue test. For the proposed specimen, the surroundings of the specimen including the side support strips except for six bridges are etched durin...
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| Published in: | Key engineering materials 2006-01, Vol.321-323, p.136-139 |
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| Main Authors: | , , , , , |
| Format: | Article |
| Language: | English |
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| cited_by | cdi_FETCH-LOGICAL-c301t-6814f1251c96d455d72a5f85c9d3ae5f5ee5795f860b7d3b479db031a16074453 |
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| cites | cdi_FETCH-LOGICAL-c301t-6814f1251c96d455d72a5f85c9d3ae5f5ee5795f860b7d3b479db031a16074453 |
| container_end_page | 139 |
| container_issue | |
| container_start_page | 136 |
| container_title | Key engineering materials |
| container_volume | 321-323 |
| creator | Park, Jun Hyub Choa, Sung Hoon Kim, Yun Jae Choi, Nam Sup Myung, Man Sik Lee, Chang Seung |
| description | This paper describes a novel test procedure, new structure of specimen easy to manipulate,
align and grip a thin-film and test machine for a tensile and fatigue test. For the proposed specimen,
the surroundings of the specimen including the side support strips except for six bridges are etched
during the fabrication of the specimen, which in turn makes it possible to cut off easily the specimen
from the wafer by minimizing a damage to the test film and also possible to produce the specimen in
mass production. For the present specimen, a small hole is made at the grip end and using a small pin
for setting the specimen onto the tester, the setting process and alignment of specimen is much easier,
compared to the specimen proposed by Sharpe et al. To gain confidence in reliability of testing results,
pre-test using the Al-3%Ti is performed, which is widely used in the RF switch and other MEMS
devices. Tensile tests are performed, from which tensile strengths of the Al-3%Ti are measured as
343±16.22MPa at 200μm width and 1.1μm thickness. |
| doi_str_mv | 10.4028/www.scientific.net/KEM.321-323.136 |
| format | article |
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align and grip a thin-film and test machine for a tensile and fatigue test. For the proposed specimen,
the surroundings of the specimen including the side support strips except for six bridges are etched
during the fabrication of the specimen, which in turn makes it possible to cut off easily the specimen
from the wafer by minimizing a damage to the test film and also possible to produce the specimen in
mass production. For the present specimen, a small hole is made at the grip end and using a small pin
for setting the specimen onto the tester, the setting process and alignment of specimen is much easier,
compared to the specimen proposed by Sharpe et al. To gain confidence in reliability of testing results,
pre-test using the Al-3%Ti is performed, which is widely used in the RF switch and other MEMS
devices. Tensile tests are performed, from which tensile strengths of the Al-3%Ti are measured as
343±16.22MPa at 200μm width and 1.1μm thickness.</description><identifier>ISSN: 1013-9826</identifier><identifier>ISSN: 1662-9795</identifier><identifier>EISSN: 1662-9795</identifier><identifier>DOI: 10.4028/www.scientific.net/KEM.321-323.136</identifier><language>eng</language><publisher>Trans Tech Publications Ltd</publisher><ispartof>Key engineering materials, 2006-01, Vol.321-323, p.136-139</ispartof><rights>2006 Trans Tech Publications Ltd</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c301t-6814f1251c96d455d72a5f85c9d3ae5f5ee5795f860b7d3b479db031a16074453</citedby><cites>FETCH-LOGICAL-c301t-6814f1251c96d455d72a5f85c9d3ae5f5ee5795f860b7d3b479db031a16074453</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Uhttps://www.scientific.net/Image/TitleCover/42?width=600</thumbnail><link.rule.ids>314,776,780,27901,27902</link.rule.ids></links><search><creatorcontrib>Park, Jun Hyub</creatorcontrib><creatorcontrib>Choa, Sung Hoon</creatorcontrib><creatorcontrib>Kim, Yun Jae</creatorcontrib><creatorcontrib>Choi, Nam Sup</creatorcontrib><creatorcontrib>Myung, Man Sik</creatorcontrib><creatorcontrib>Lee, Chang Seung</creatorcontrib><title>Novel Test Procedure of Tensile Test for MEMS Materials</title><title>Key engineering materials</title><description>This paper describes a novel test procedure, new structure of specimen easy to manipulate,
align and grip a thin-film and test machine for a tensile and fatigue test. For the proposed specimen,
the surroundings of the specimen including the side support strips except for six bridges are etched
during the fabrication of the specimen, which in turn makes it possible to cut off easily the specimen
from the wafer by minimizing a damage to the test film and also possible to produce the specimen in
mass production. For the present specimen, a small hole is made at the grip end and using a small pin
for setting the specimen onto the tester, the setting process and alignment of specimen is much easier,
compared to the specimen proposed by Sharpe et al. To gain confidence in reliability of testing results,
pre-test using the Al-3%Ti is performed, which is widely used in the RF switch and other MEMS
devices. Tensile tests are performed, from which tensile strengths of the Al-3%Ti are measured as
343±16.22MPa at 200μm width and 1.1μm thickness.</description><issn>1013-9826</issn><issn>1662-9795</issn><issn>1662-9795</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2006</creationdate><recordtype>article</recordtype><recordid>eNqVkM1OwzAQhC0EEqXwDjlxQErqn9iJj1BaQDSARDlbrrMWqdK42AkVb49RkDhzWM1qdzWa_RC6IjjLMS1nh8MhC6aBrm9sY7IO-tnjosoYJSmjLCNMHKEJEYKmspD8OPaYsFSWVJyisxC2GDNSEj5BxZP7hDZZQ-iTF-8M1IOHxNk46ULTwrixzifVonpNKt2Db3QbztGJjQIXvzpFb8vFen6frp7vHubXq9QwTPpUlCS3hHJipKhzzuuCam5LbmTNNHDLAXgMaEuBN0XNNnkh603MponARZ5zNkWXo-_eu48hZlG7JhhoW92BG4KikmGZszIe3oyHxrsQPFi1981O-y9FsPphpiIz9cdMRWYqMlORWSymIrNocjua9F53oQfzrrZu8F388D8237CUfYQ</recordid><startdate>20060101</startdate><enddate>20060101</enddate><creator>Park, Jun Hyub</creator><creator>Choa, Sung Hoon</creator><creator>Kim, Yun Jae</creator><creator>Choi, Nam Sup</creator><creator>Myung, Man Sik</creator><creator>Lee, Chang Seung</creator><general>Trans Tech Publications Ltd</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7QF</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20060101</creationdate><title>Novel Test Procedure of Tensile Test for MEMS Materials</title><author>Park, Jun Hyub ; Choa, Sung Hoon ; Kim, Yun Jae ; Choi, Nam Sup ; Myung, Man Sik ; Lee, Chang Seung</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c301t-6814f1251c96d455d72a5f85c9d3ae5f5ee5795f860b7d3b479db031a16074453</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2006</creationdate><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Park, Jun Hyub</creatorcontrib><creatorcontrib>Choa, Sung Hoon</creatorcontrib><creatorcontrib>Kim, Yun Jae</creatorcontrib><creatorcontrib>Choi, Nam Sup</creatorcontrib><creatorcontrib>Myung, Man Sik</creatorcontrib><creatorcontrib>Lee, Chang Seung</creatorcontrib><collection>CrossRef</collection><collection>Aluminium Industry Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Key engineering materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Park, Jun Hyub</au><au>Choa, Sung Hoon</au><au>Kim, Yun Jae</au><au>Choi, Nam Sup</au><au>Myung, Man Sik</au><au>Lee, Chang Seung</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Novel Test Procedure of Tensile Test for MEMS Materials</atitle><jtitle>Key engineering materials</jtitle><date>2006-01-01</date><risdate>2006</risdate><volume>321-323</volume><spage>136</spage><epage>139</epage><pages>136-139</pages><issn>1013-9826</issn><issn>1662-9795</issn><eissn>1662-9795</eissn><abstract>This paper describes a novel test procedure, new structure of specimen easy to manipulate,
align and grip a thin-film and test machine for a tensile and fatigue test. For the proposed specimen,
the surroundings of the specimen including the side support strips except for six bridges are etched
during the fabrication of the specimen, which in turn makes it possible to cut off easily the specimen
from the wafer by minimizing a damage to the test film and also possible to produce the specimen in
mass production. For the present specimen, a small hole is made at the grip end and using a small pin
for setting the specimen onto the tester, the setting process and alignment of specimen is much easier,
compared to the specimen proposed by Sharpe et al. To gain confidence in reliability of testing results,
pre-test using the Al-3%Ti is performed, which is widely used in the RF switch and other MEMS
devices. Tensile tests are performed, from which tensile strengths of the Al-3%Ti are measured as
343±16.22MPa at 200μm width and 1.1μm thickness.</abstract><pub>Trans Tech Publications Ltd</pub><doi>10.4028/www.scientific.net/KEM.321-323.136</doi><tpages>4</tpages></addata></record> |
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| source | Scientific.net Journals |
| title | Novel Test Procedure of Tensile Test for MEMS Materials |
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