Electrochemical patterning of copper using microcontact printing

This paper demonstrates that micropatterns of copper films can be fabricated by selective electrochemical etching of copper using microcontact printing of self-assembled monolayers (SAMs). The elastomeric stamps which have microstructures on their surfaces are made out of polydimethylsiloxane and th...

Full description

Saved in:
Bibliographic Details
Published in:Journal of the Electrochemical Society 2004, Vol.151 (7), p.C455-C458
Main Authors: LIM, Jong-Heun, KIM, Nam-Hoon, CHANG, Eui-Goo
Format: Article
Language:English
Subjects:
Cross-disciplinary physics: materials science
rheology
Exact sciences and technology
Materials science
Physics
Surface treatments
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:This paper demonstrates that micropatterns of copper films can be fabricated by selective electrochemical etching of copper using microcontact printing of self-assembled monolayers (SAMs). The elastomeric stamps which have microstructures on their surfaces are made out of polydimethylsiloxane and then are inked with a solution of an alkanethiol in ethanol. SAMs of alkanethiol are patterned on the copper films by contacting stamps with the substrates. The patterned substrates are etched electrochemically in an electrolyte. SAMs of alkanethiol act as an electrochemical barrier leading to selective etching of copper films. Microstructures of copper with dimensions as small as 1.5 mum have been produced using this procedure. This method shows the capability of fabricating simple structures on a scale comparable to UV photolithography which produces printed circuits of copper for the semiconductor industry.
ISSN:0013-4651
1945-7111
DOI:10.1149/1.1753585