Materials issues in the processing, the operation and the reliability of MEMS

In this article materials issues that arise during the processing and operation of micro-electro mechanical systems devices (MEMS), and their impact on the functionality and reliability, are discussed. The article starts with the example of an RF-MEMS switch process flow, indicating how and why cert...

Full description

Saved in:
Bibliographic Details
Published in:Microelectronic engineering 2004-10, Vol.76 (1-4), p.245-257
Main Authors: Witvrouw, A., Tilmans, H.A.C., De Wolf, I.
Format: Article
Language:English
Subjects:
Applied sciences
Circuit properties
Design. Technologies. Operation analysis. Testing
Electric, optical and optoelectronic circuits
Electronic circuits
Electronics
Exact sciences and technology
Integrated circuits
MEMS
MEMS packaging
Micro- and nanoelectromechanical devices (mems/nems)
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Stiction
Stress
Switching, multiplexing, switched capacity circuits
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:In this article materials issues that arise during the processing and operation of micro-electro mechanical systems devices (MEMS), and their impact on the functionality and reliability, are discussed. The article starts with the example of an RF-MEMS switch process flow, indicating how and why certain materials are chosen. Then two specific MEMS materials issues, e.g. stiction and stress, are covered. Finally, the so-called ‘zero-level’ packaging of MEMS as well as the effect packaging can have on the device and its operation will be reviewed.
ISSN:0167-9317
1873-5568
DOI:10.1016/j.mee.2004.07.001