Loading…

Materials issues in the processing, the operation and the reliability of MEMS

In this article materials issues that arise during the processing and operation of micro-electro mechanical systems devices (MEMS), and their impact on the functionality and reliability, are discussed. The article starts with the example of an RF-MEMS switch process flow, indicating how and why cert...

Full description

Saved in:

Bibliographic Details
Published in:	Microelectronic engineering 2004-10, Vol.76 (1-4), p.245-257
Main Authors:	Witvrouw, A., Tilmans, H.A.C., De Wolf, I.
Format:	Article
Language:	English
Subjects:	Applied sciences Circuit properties Design. Technologies. Operation analysis. Testing Electric, optical and optoelectronic circuits Electronic circuits Electronics Exact sciences and technology Integrated circuits MEMS MEMS packaging Micro- and nanoelectromechanical devices (mems/nems) Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Stiction Stress Switching, multiplexing, switched capacity circuits
Citations:	Items that this one cites Items that cite this one
Online Access:	Get full text
Tags:	Add Tag No Tags, Be the first to tag this record!

cited_by	cdi_FETCH-LOGICAL-c422t-cfed2dde22b62ffde38c11325552607e074f8ef27f1953172aabe8dfab60049f3
cites	cdi_FETCH-LOGICAL-c422t-cfed2dde22b62ffde38c11325552607e074f8ef27f1953172aabe8dfab60049f3
container_end_page	257
container_issue	1-4
container_start_page	245
container_title	Microelectronic engineering
container_volume	76
creator	Witvrouw, A. Tilmans, H.A.C. De Wolf, I.
description	In this article materials issues that arise during the processing and operation of micro-electro mechanical systems devices (MEMS), and their impact on the functionality and reliability, are discussed. The article starts with the example of an RF-MEMS switch process flow, indicating how and why certain materials are chosen. Then two specific MEMS materials issues, e.g. stiction and stress, are covered. Finally, the so-called ‘zero-level’ packaging of MEMS as well as the effect packaging can have on the device and its operation will be reviewed.
doi_str_mv	10.1016/j.mee.2004.07.001
format	article
fullrecord	<record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_29410798</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><els_id>S0167931704003594</els_id><sourcerecordid>29410798</sourcerecordid><originalsourceid>FETCH-LOGICAL-c422t-cfed2dde22b62ffde38c11325552607e074f8ef27f1953172aabe8dfab60049f3</originalsourceid><addsrcrecordid>eNp9kMtOwzAQRS0EEqXwAeyygRUJHufhRKxQVR5SIxbA2nLsMbhKk2K7SP17TFuJHavRjM7cuXMJuQSaAYXqdpmtEDNGaZFRnlEKR2QCNc_TsqzqYzKJDE-bHPgpOfN-GYGqoPWEtK0M6KzsfWK932AsQxI-MVm7UaH3dvi42fXjGp0MdhwSOejdxGFvZWd7G7bJaJJ23r6ekxMTpfDiUKfk_WH-NntKFy-Pz7P7RaoKxkKqDGqmNTLWVcwYjXmtAHJWliWrKEfKC1OjYdxAU0bPTMoOa21kV8UHG5NPyfVeN7r8iqaDWFmvsO_lgOPGC9YUQHlTRxD2oHKj9w6NWDu7km4rgIrf4MRSxODEb3CCchFziTtXB3HpleyNk4Oy_m-xghIKaCJ3t-cwfvpt0QmvLA4KtXWogtCj_efKD4y2guo</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>29410798</pqid></control><display><type>article</type><title>Materials issues in the processing, the operation and the reliability of MEMS</title><source>ScienceDirect Journals</source><creator>Witvrouw, A. ; Tilmans, H.A.C. ; De Wolf, I.</creator><creatorcontrib>Witvrouw, A. ; Tilmans, H.A.C. ; De Wolf, I.</creatorcontrib><description>In this article materials issues that arise during the processing and operation of micro-electro mechanical systems devices (MEMS), and their impact on the functionality and reliability, are discussed. The article starts with the example of an RF-MEMS switch process flow, indicating how and why certain materials are chosen. Then two specific MEMS materials issues, e.g. stiction and stress, are covered. Finally, the so-called ‘zero-level’ packaging of MEMS as well as the effect packaging can have on the device and its operation will be reviewed.</description><identifier>ISSN: 0167-9317</identifier><identifier>EISSN: 1873-5568</identifier><identifier>DOI: 10.1016/j.mee.2004.07.001</identifier><identifier>CODEN: MIENEF</identifier><language>eng</language><publisher>Amsterdam: Elsevier B.V</publisher><subject>Applied sciences ; Circuit properties ; Design. Technologies. Operation analysis. Testing ; Electric, optical and optoelectronic circuits ; Electronic circuits ; Electronics ; Exact sciences and technology ; Integrated circuits ; MEMS ; MEMS packaging ; Micro- and nanoelectromechanical devices (mems/nems) ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Stiction ; Stress ; Switching, multiplexing, switched capacity circuits</subject><ispartof>Microelectronic engineering, 2004-10, Vol.76 (1-4), p.245-257</ispartof><rights>2004 Elsevier B.V.</rights><rights>2004 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c422t-cfed2dde22b62ffde38c11325552607e074f8ef27f1953172aabe8dfab60049f3</citedby><cites>FETCH-LOGICAL-c422t-cfed2dde22b62ffde38c11325552607e074f8ef27f1953172aabe8dfab60049f3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>309,310,314,780,784,789,790,23930,23931,25140,27924,27925</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=16151419$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Witvrouw, A.</creatorcontrib><creatorcontrib>Tilmans, H.A.C.</creatorcontrib><creatorcontrib>De Wolf, I.</creatorcontrib><title>Materials issues in the processing, the operation and the reliability of MEMS</title><title>Microelectronic engineering</title><description>In this article materials issues that arise during the processing and operation of micro-electro mechanical systems devices (MEMS), and their impact on the functionality and reliability, are discussed. The article starts with the example of an RF-MEMS switch process flow, indicating how and why certain materials are chosen. Then two specific MEMS materials issues, e.g. stiction and stress, are covered. Finally, the so-called ‘zero-level’ packaging of MEMS as well as the effect packaging can have on the device and its operation will be reviewed.</description><subject>Applied sciences</subject><subject>Circuit properties</subject><subject>Design. Technologies. Operation analysis. Testing</subject><subject>Electric, optical and optoelectronic circuits</subject><subject>Electronic circuits</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Integrated circuits</subject><subject>MEMS</subject><subject>MEMS packaging</subject><subject>Micro- and nanoelectromechanical devices (mems/nems)</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Stiction</subject><subject>Stress</subject><subject>Switching, multiplexing, switched capacity circuits</subject><issn>0167-9317</issn><issn>1873-5568</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2004</creationdate><recordtype>article</recordtype><recordid>eNp9kMtOwzAQRS0EEqXwAeyygRUJHufhRKxQVR5SIxbA2nLsMbhKk2K7SP17TFuJHavRjM7cuXMJuQSaAYXqdpmtEDNGaZFRnlEKR2QCNc_TsqzqYzKJDE-bHPgpOfN-GYGqoPWEtK0M6KzsfWK932AsQxI-MVm7UaH3dvi42fXjGp0MdhwSOejdxGFvZWd7G7bJaJJ23r6ekxMTpfDiUKfk_WH-NntKFy-Pz7P7RaoKxkKqDGqmNTLWVcwYjXmtAHJWliWrKEfKC1OjYdxAU0bPTMoOa21kV8UHG5NPyfVeN7r8iqaDWFmvsO_lgOPGC9YUQHlTRxD2oHKj9w6NWDu7km4rgIrf4MRSxODEb3CCchFziTtXB3HpleyNk4Oy_m-xghIKaCJ3t-cwfvpt0QmvLA4KtXWogtCj_efKD4y2guo</recordid><startdate>20041001</startdate><enddate>20041001</enddate><creator>Witvrouw, A.</creator><creator>Tilmans, H.A.C.</creator><creator>De Wolf, I.</creator><general>Elsevier B.V</general><general>Elsevier Science</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope></search><sort><creationdate>20041001</creationdate><title>Materials issues in the processing, the operation and the reliability of MEMS</title><author>Witvrouw, A. ; Tilmans, H.A.C. ; De Wolf, I.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c422t-cfed2dde22b62ffde38c11325552607e074f8ef27f1953172aabe8dfab60049f3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2004</creationdate><topic>Applied sciences</topic><topic>Circuit properties</topic><topic>Design. Technologies. Operation analysis. Testing</topic><topic>Electric, optical and optoelectronic circuits</topic><topic>Electronic circuits</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Integrated circuits</topic><topic>MEMS</topic><topic>MEMS packaging</topic><topic>Micro- and nanoelectromechanical devices (mems/nems)</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Stiction</topic><topic>Stress</topic><topic>Switching, multiplexing, switched capacity circuits</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Witvrouw, A.</creatorcontrib><creatorcontrib>Tilmans, H.A.C.</creatorcontrib><creatorcontrib>De Wolf, I.</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Microelectronic engineering</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Witvrouw, A.</au><au>Tilmans, H.A.C.</au><au>De Wolf, I.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Materials issues in the processing, the operation and the reliability of MEMS</atitle><jtitle>Microelectronic engineering</jtitle><date>2004-10-01</date><risdate>2004</risdate><volume>76</volume><issue>1-4</issue><spage>245</spage><epage>257</epage><pages>245-257</pages><issn>0167-9317</issn><eissn>1873-5568</eissn><coden>MIENEF</coden><abstract>In this article materials issues that arise during the processing and operation of micro-electro mechanical systems devices (MEMS), and their impact on the functionality and reliability, are discussed. The article starts with the example of an RF-MEMS switch process flow, indicating how and why certain materials are chosen. Then two specific MEMS materials issues, e.g. stiction and stress, are covered. Finally, the so-called ‘zero-level’ packaging of MEMS as well as the effect packaging can have on the device and its operation will be reviewed.</abstract><cop>Amsterdam</cop><pub>Elsevier B.V</pub><doi>10.1016/j.mee.2004.07.001</doi><tpages>13</tpages></addata></record>
fulltext	fulltext
identifier	ISSN: 0167-9317
ispartof	Microelectronic engineering, 2004-10, Vol.76 (1-4), p.245-257
issn	0167-9317 1873-5568
language	eng
recordid	cdi_proquest_miscellaneous_29410798
source	ScienceDirect Journals
subjects	Applied sciences Circuit properties Design. Technologies. Operation analysis. Testing Electric, optical and optoelectronic circuits Electronic circuits Electronics Exact sciences and technology Integrated circuits MEMS MEMS packaging Micro- and nanoelectromechanical devices (mems/nems) Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Stiction Stress Switching, multiplexing, switched capacity circuits
title	Materials issues in the processing, the operation and the reliability of MEMS
url	http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-19T19%3A56%3A17IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Materials%20issues%20in%20the%20processing,%20the%20operation%20and%20the%20reliability%20of%20MEMS&rft.jtitle=Microelectronic%20engineering&rft.au=Witvrouw,%20A.&rft.date=2004-10-01&rft.volume=76&rft.issue=1-4&rft.spage=245&rft.epage=257&rft.pages=245-257&rft.issn=0167-9317&rft.eissn=1873-5568&rft.coden=MIENEF&rft_id=info:doi/10.1016/j.mee.2004.07.001&rft_dat=%3Cproquest_cross%3E29410798%3C/proquest_cross%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c422t-cfed2dde22b62ffde38c11325552607e074f8ef27f1953172aabe8dfab60049f3%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_pqid=29410798&rft_id=info:pmid/&rfr_iscdi=true