Understanding the thermal, mechanical and electrical properties of epoxy nanocomposites

• Published in: Materials science & engineering. A, Structural materials : properties, microstructure and processing Structural materials : properties, microstructure and processing, 2007-02, Vol.445, p.567-578
• Main Authors: Sarathi, R., Sahu, R.K., Rajeshkumar, P.
• Format: Article
• Language: English
• Subjects: Applied sciences; Breakdown; Contact angle; Electrical, magnetic and optical properties; Epoxy resin; Exact sciences and technology; Insulation; Nanoclay; Nanocomposites; Organic polymers; Physicochemistry of polymers; Properties and characterization; Weibull distribution
• ISSN: 0921-5093; 1873-4936
• DOI: 10.1016/j.msea.2006.09.077

In the present work, the electrical, mechanical and thermal properties of epoxy nanocomposite materials were studied. The electrical insulation characteristics were analyzed through short time breakdown voltage test, accelerated electrical ageing test, and by tracking test. The breakdown voltage increases with increase in nano-clay content up to 5 wt%, under AC and DC voltages. The volume resistivity, permittivity and tan( δ) of the epoxy nanocomposites were measured. The Weibull studies indicate that addition of nanoclay upto 5 wt% enhances the characteristic life of epoxy nanocomposite insulation material. The tracking test results indicate that the tracking time is high with epoxy nanocomposites as compared to pure epoxy. Ageing studies were carried out to understand the surface characteristic variation through contact angle measurement. The hydrophobicity of the insulating material was analysed through contact angle measurement. The diffusion coefficients of the material with different percentage of clay in epoxy nanocomposites were calculated. The exfoliation characteristics in epoxy nanocomposites were analyzed through wide angle X-ray diffraction (WAXD) studies. The thermal behaviour of the epoxy nanocomposites was analyzed by carrying out thermo gravimetric-differential thermal analysis (TG-DTA) studies. Heat deflection temperature of the material was measured to understand the stability of the material for intermittent temperature variation. The dynamic mechanical analysis (DMA) results indicated that storage modulus of the material increases with small amount of clay in epoxy resin. The activation energy of the material was calculated from the DMA results.