Loading…

A preliminary investigation of thermo-elastic damping in silicon rings

Zener's model for thermo-elastic loss, when applied to uniform beams undergoing flexural vibrations, gives theoretical predictions of mechanical Q-factor that often agree well with experimental measurements. The use of silicon ring resonators in MEMS devices is now becoming increasingly common....

Full description

Saved in:
Bibliographic Details
Published in:Journal of micromechanics and microengineering 2004-09, Vol.14 (9), p.S108-S113
Main Authors: Wong, S J, Fox, C H J, McWilliam, S, Fell, C P, Eley, R
Format: Article
Language:English
Subjects:
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
cited_by cdi_FETCH-LOGICAL-c378t-b90540296b76a18e34191975a54dd32700538f9fa01b8755b84297d0e41e04ee3
cites cdi_FETCH-LOGICAL-c378t-b90540296b76a18e34191975a54dd32700538f9fa01b8755b84297d0e41e04ee3
container_end_page S113
container_issue 9
container_start_page S108
container_title Journal of micromechanics and microengineering
container_volume 14
creator Wong, S J
Fox, C H J
McWilliam, S
Fell, C P
Eley, R
description Zener's model for thermo-elastic loss, when applied to uniform beams undergoing flexural vibrations, gives theoretical predictions of mechanical Q-factor that often agree well with experimental measurements. The use of silicon ring resonators in MEMS devices is now becoming increasingly common. This paper considers the application of Zener's theory to thin, circular rings and presents a simple expression for the Q-factor associated with in-plane flexural modes of vibration. The theoretical predictions are shown to be in good agreement with experimental measurements for a practically relevant range of ring sizes. The relationships between ring dimensions, ambient temperature and Q-factor are explored.
doi_str_mv 10.1088/0960-1317/14/9/019
format article
fullrecord <record><control><sourceid>proquest_pasca</sourceid><recordid>TN_cdi_proquest_miscellaneous_29523982</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>29523982</sourcerecordid><originalsourceid>FETCH-LOGICAL-c378t-b90540296b76a18e34191975a54dd32700538f9fa01b8755b84297d0e41e04ee3</originalsourceid><addsrcrecordid>eNqN0E9LwzAYBvAgCs7pF_DUi4KH2PdtkjY5juFUGHjRc0jbdEb6z6QT_PZmbOhhF08h4fc-5H0IuUa4R5AyBZUDRYZFijxVKaA6ITNkOdKcM3VKZr_gnFyE8AGAKFHOyGqRjN62rnO98d-J679smNzGTG7ok6FJpnfru4Ha1sTnKqlNN7p-E10SXOuqiHy8h0ty1pg22KvDOSdvq4fX5RNdvzw-LxdrWrFCTrRUIDhkKi-L3KC0jKNCVQgjeF2zrAAQTDaqMYClLIQoJc9UUYPlaIFby-bkdp87-uFzG7-qOxcq27amt8M26EyJjCmZRZjtYeWHELxt9OhdF1fUCHpXmd41oneNaORa6VhZHLo5pJtQmbbxpq9c-JvMEbjgLDq6d24Y_5d7d-yPnR7rhv0AycSExw</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>29523982</pqid></control><display><type>article</type><title>A preliminary investigation of thermo-elastic damping in silicon rings</title><source>Institute of Physics:Jisc Collections:IOP Publishing Read and Publish 2024-2025 (Reading List)</source><creator>Wong, S J ; Fox, C H J ; McWilliam, S ; Fell, C P ; Eley, R</creator><creatorcontrib>Wong, S J ; Fox, C H J ; McWilliam, S ; Fell, C P ; Eley, R</creatorcontrib><description>Zener's model for thermo-elastic loss, when applied to uniform beams undergoing flexural vibrations, gives theoretical predictions of mechanical Q-factor that often agree well with experimental measurements. The use of silicon ring resonators in MEMS devices is now becoming increasingly common. This paper considers the application of Zener's theory to thin, circular rings and presents a simple expression for the Q-factor associated with in-plane flexural modes of vibration. The theoretical predictions are shown to be in good agreement with experimental measurements for a practically relevant range of ring sizes. The relationships between ring dimensions, ambient temperature and Q-factor are explored.</description><identifier>ISSN: 0960-1317</identifier><identifier>EISSN: 1361-6439</identifier><identifier>DOI: 10.1088/0960-1317/14/9/019</identifier><language>eng</language><publisher>Bristol: IOP Publishing</publisher><subject>Applied sciences ; Electronics ; Exact sciences and technology ; Instruments, apparatus, components and techniques common to several branches of physics and astronomy ; Mechanical engineering. Machine design ; Mechanical instruments, equipment and techniques ; Microelectronic fabrication (materials and surfaces technology) ; Micromechanical devices and systems ; Physics ; Precision engineering, watch making ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><ispartof>Journal of micromechanics and microengineering, 2004-09, Vol.14 (9), p.S108-S113</ispartof><rights>2004 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c378t-b90540296b76a18e34191975a54dd32700538f9fa01b8755b84297d0e41e04ee3</citedby><cites>FETCH-LOGICAL-c378t-b90540296b76a18e34191975a54dd32700538f9fa01b8755b84297d0e41e04ee3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>309,310,314,780,784,789,790,23930,23931,25140,27924,27925</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&amp;idt=16104543$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Wong, S J</creatorcontrib><creatorcontrib>Fox, C H J</creatorcontrib><creatorcontrib>McWilliam, S</creatorcontrib><creatorcontrib>Fell, C P</creatorcontrib><creatorcontrib>Eley, R</creatorcontrib><title>A preliminary investigation of thermo-elastic damping in silicon rings</title><title>Journal of micromechanics and microengineering</title><description>Zener's model for thermo-elastic loss, when applied to uniform beams undergoing flexural vibrations, gives theoretical predictions of mechanical Q-factor that often agree well with experimental measurements. The use of silicon ring resonators in MEMS devices is now becoming increasingly common. This paper considers the application of Zener's theory to thin, circular rings and presents a simple expression for the Q-factor associated with in-plane flexural modes of vibration. The theoretical predictions are shown to be in good agreement with experimental measurements for a practically relevant range of ring sizes. The relationships between ring dimensions, ambient temperature and Q-factor are explored.</description><subject>Applied sciences</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Instruments, apparatus, components and techniques common to several branches of physics and astronomy</subject><subject>Mechanical engineering. Machine design</subject><subject>Mechanical instruments, equipment and techniques</subject><subject>Microelectronic fabrication (materials and surfaces technology)</subject><subject>Micromechanical devices and systems</subject><subject>Physics</subject><subject>Precision engineering, watch making</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><issn>0960-1317</issn><issn>1361-6439</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2004</creationdate><recordtype>article</recordtype><recordid>eNqN0E9LwzAYBvAgCs7pF_DUi4KH2PdtkjY5juFUGHjRc0jbdEb6z6QT_PZmbOhhF08h4fc-5H0IuUa4R5AyBZUDRYZFijxVKaA6ITNkOdKcM3VKZr_gnFyE8AGAKFHOyGqRjN62rnO98d-J679smNzGTG7ok6FJpnfru4Ha1sTnKqlNN7p-E10SXOuqiHy8h0ty1pg22KvDOSdvq4fX5RNdvzw-LxdrWrFCTrRUIDhkKi-L3KC0jKNCVQgjeF2zrAAQTDaqMYClLIQoJc9UUYPlaIFby-bkdp87-uFzG7-qOxcq27amt8M26EyJjCmZRZjtYeWHELxt9OhdF1fUCHpXmd41oneNaORa6VhZHLo5pJtQmbbxpq9c-JvMEbjgLDq6d24Y_5d7d-yPnR7rhv0AycSExw</recordid><startdate>20040901</startdate><enddate>20040901</enddate><creator>Wong, S J</creator><creator>Fox, C H J</creator><creator>McWilliam, S</creator><creator>Fell, C P</creator><creator>Eley, R</creator><general>IOP Publishing</general><general>Institute of Physics</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7TB</scope><scope>8FD</scope><scope>FR3</scope><scope>KR7</scope></search><sort><creationdate>20040901</creationdate><title>A preliminary investigation of thermo-elastic damping in silicon rings</title><author>Wong, S J ; Fox, C H J ; McWilliam, S ; Fell, C P ; Eley, R</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c378t-b90540296b76a18e34191975a54dd32700538f9fa01b8755b84297d0e41e04ee3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2004</creationdate><topic>Applied sciences</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Instruments, apparatus, components and techniques common to several branches of physics and astronomy</topic><topic>Mechanical engineering. Machine design</topic><topic>Mechanical instruments, equipment and techniques</topic><topic>Microelectronic fabrication (materials and surfaces technology)</topic><topic>Micromechanical devices and systems</topic><topic>Physics</topic><topic>Precision engineering, watch making</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Wong, S J</creatorcontrib><creatorcontrib>Fox, C H J</creatorcontrib><creatorcontrib>McWilliam, S</creatorcontrib><creatorcontrib>Fell, C P</creatorcontrib><creatorcontrib>Eley, R</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Mechanical &amp; Transportation Engineering Abstracts</collection><collection>Technology Research Database</collection><collection>Engineering Research Database</collection><collection>Civil Engineering Abstracts</collection><jtitle>Journal of micromechanics and microengineering</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Wong, S J</au><au>Fox, C H J</au><au>McWilliam, S</au><au>Fell, C P</au><au>Eley, R</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>A preliminary investigation of thermo-elastic damping in silicon rings</atitle><jtitle>Journal of micromechanics and microengineering</jtitle><date>2004-09-01</date><risdate>2004</risdate><volume>14</volume><issue>9</issue><spage>S108</spage><epage>S113</epage><pages>S108-S113</pages><issn>0960-1317</issn><eissn>1361-6439</eissn><abstract>Zener's model for thermo-elastic loss, when applied to uniform beams undergoing flexural vibrations, gives theoretical predictions of mechanical Q-factor that often agree well with experimental measurements. The use of silicon ring resonators in MEMS devices is now becoming increasingly common. This paper considers the application of Zener's theory to thin, circular rings and presents a simple expression for the Q-factor associated with in-plane flexural modes of vibration. The theoretical predictions are shown to be in good agreement with experimental measurements for a practically relevant range of ring sizes. The relationships between ring dimensions, ambient temperature and Q-factor are explored.</abstract><cop>Bristol</cop><pub>IOP Publishing</pub><doi>10.1088/0960-1317/14/9/019</doi></addata></record>
fulltext fulltext
identifier ISSN: 0960-1317
ispartof Journal of micromechanics and microengineering, 2004-09, Vol.14 (9), p.S108-S113
issn 0960-1317
1361-6439
language eng
recordid cdi_proquest_miscellaneous_29523982
source Institute of Physics:Jisc Collections:IOP Publishing Read and Publish 2024-2025 (Reading List)
subjects Applied sciences
Electronics
Exact sciences and technology
Instruments, apparatus, components and techniques common to several branches of physics and astronomy
Mechanical engineering. Machine design
Mechanical instruments, equipment and techniques
Microelectronic fabrication (materials and surfaces technology)
Micromechanical devices and systems
Physics
Precision engineering, watch making
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
title A preliminary investigation of thermo-elastic damping in silicon rings
url http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-26T16%3A11%3A20IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_pasca&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=A%20preliminary%20investigation%20of%20thermo-elastic%20damping%20in%20silicon%20rings&rft.jtitle=Journal%20of%20micromechanics%20and%20microengineering&rft.au=Wong,%20S%20J&rft.date=2004-09-01&rft.volume=14&rft.issue=9&rft.spage=S108&rft.epage=S113&rft.pages=S108-S113&rft.issn=0960-1317&rft.eissn=1361-6439&rft_id=info:doi/10.1088/0960-1317/14/9/019&rft_dat=%3Cproquest_pasca%3E29523982%3C/proquest_pasca%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c378t-b90540296b76a18e34191975a54dd32700538f9fa01b8755b84297d0e41e04ee3%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_pqid=29523982&rft_id=info:pmid/&rfr_iscdi=true