The properties of copper films deposited on polyimide by nitrogen and oxygen plasma pre-treatment

Extensive studies on the relationship between a copper thin film and its polyimide substrate show that the adhesion strength is very weak. In this work, we show how to reduce Cu film resistivity and improve the adhesion strength between Cu and polyimide. After nitrogen and oxygen plasma treatment, p...

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Bibliographic Details
Published in:Applied surface science 2005-12, Vol.252 (5), p.1818-1825
Main Authors: Yang, Chih-hao, Lee, Shih-chin, Wu, Jun-ming, Lin, Tien-chai
Format: Article
Language:English
Subjects:
Adhesion
Condensed matter: electronic structure, electrical, magnetic, and optical properties
Condensed matter: structure, mechanical and thermal properties
Cross-disciplinary physics: materials science
rheology
Cu film
Exact sciences and technology
Physics
Plasma treatment
Polyimide
Resistivity
Sputtering
XPS
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Summary:Extensive studies on the relationship between a copper thin film and its polyimide substrate show that the adhesion strength is very weak. In this work, we show how to reduce Cu film resistivity and improve the adhesion strength between Cu and polyimide. After nitrogen and oxygen plasma treatment, polyimide substrates can substantially improve the resistivity and adhesion strength deposited Cu. It is found that the lowest resistivity is 4.22 μΩ cm and the maximum adhesion strength is 72.23 MPa for a polymide substrate treated in oxygen plasma for 5 min.
ISSN:0169-4332
1873-5584
DOI:10.1016/j.apsusc.2005.03.182