Electronic transport in dielectrophoretically grown nanowires

Gold nanoparticles with mean diameter 10–15 nm have been synthesized and stabilized using capping agents in a polar solvent (water) and a non-polar solvent (dodecane). Using two gold bond wires (diameter 0.25 mm and separated by less than 10 μm) as electrodes a sinusoidal driving voltage was applied...

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Bibliographic Details
Published in:Journal of materials science 2006-12, Vol.41 (24), p.8166-8172
Main Authors: HARROWER, C. T, OLIVER, D. R
Format: Article
Language:English
Subjects:
Applied sciences
Capping
Condensed matter: electronic structure, electrical, magnetic, and optical properties
Conductance
Cross-disciplinary physics: materials science
rheology
Dielectrophoresis
Dodecane
Electrodes
Electron transport
Electronic structure and electrical properties of surfaces, interfaces, thin films and low-dimensional structures
Electronic transport in multilayers, nanoscale materials and structures
Electronics
Exact sciences and technology
Gold
Histograms
Materials science
Metals. Metallurgy
Nanoparticles
Nanoscale materials and structures: fabrication and characterization
Nanowires
Physics
Quantum wires
Resistance
Solvents
Transport
Wire
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Summary:Gold nanoparticles with mean diameter 10–15 nm have been synthesized and stabilized using capping agents in a polar solvent (water) and a non-polar solvent (dodecane). Using two gold bond wires (diameter 0.25 mm and separated by less than 10 μm) as electrodes a sinusoidal driving voltage was applied to the solution. The resulting dielectrophoresis of the solution caused deposition of these nanoparticles at the electrodes and the formation of a wire between the electrodes. Conductance studies of the wire as the final connection formed yielded evidence for low-dimensional transport character in the form of discrete (Landauer) conductance steps. Histogram analysis of the conductance data further supports the conclusion that as the wire forms the capping agents do not always contribute to the electronic transport through the wire.
ISSN:0022-2461
1573-4803
DOI:10.1007/s10853-006-0392-1