The oxidation kinetics of nickel thin films studied by spectroscopic ellipsometry

Thin nickel films deposited by d.c. magnetron sputtering on glass substrates were thermally annealed in air at temperatures in the range of 380–530 °C. The annealed samples were analyzed by ex situ spectroscopic ellipsometry. X-ray diffraction data reveal that during the oxidation process only the N...

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Bibliographic Details
Published in:Thin solid films 2006-05, Vol.503 (1-2), p.40-44
Main Authors: López-Beltrán, A.M., Mendoza-Galván, A.
Format: Article
Language:English
Subjects:
Condensed matter: structure, mechanical and thermal properties
Cross-disciplinary physics: materials science
rheology
Deposition by sputtering
Ellipsometry
Exact sciences and technology
Materials science
Methods of deposition of films and coatings
film growth and epitaxy
Nickel oxide
Oxidation
Physics
Single-crystal and powder diffraction
Structure of solids and liquids
crystallography
X-ray diffraction and scattering
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Summary:Thin nickel films deposited by d.c. magnetron sputtering on glass substrates were thermally annealed in air at temperatures in the range of 380–530 °C. The annealed samples were analyzed by ex situ spectroscopic ellipsometry. X-ray diffraction data reveal that during the oxidation process only the Ni and NiO phases are present. Thus, using an appropriate model that describes the ellipsometric spectra, the thickness of the NiO layer was obtained as a function of annealing temperature with an activation energy of 1.74 eV. Furthermore, a parabolic kinetics was found for the NiO thickness dependence on annealing time.
ISSN:0040-6090
1879-2731
DOI:10.1016/j.tsf.2005.11.031