Wafer level self-assembly of microstructures using global magnetic lifting and localized induction welding

• Published in: Journal of micromechanics and microengineering 2006-01, Vol.16 (1), p.27-32
• Main Authors: Yang, Hsueh-An, Lin, Chiung-Wen, Fang, Weileun
• Format: Article
• Language: English
• Subjects: Applied sciences; Cross-disciplinary physics: materials science; rheology; Electronics; Exact sciences and technology; Instruments, apparatus, components and techniques common to several branches of physics and astronomy; Materials science; Materials synthesis; materials processing; Mechanical engineering. Machine design; Mechanical instruments, equipment and techniques; Microelectronic fabrication (materials and surfaces technology); Micromechanical devices and systems; Physics; Precision engineering, watch making; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
• ISSN: 0960-1317; 1361-6439
• DOI: 10.1088/0960-1317/16/1/004

This study has successfully demonstrated a process to localize, assemble and weld microstructures using an external magnetic field. The primary three merits of this technology are as follows. (1) The magnetic field is not only to assemble the microstructures but also to fix them by induction welding. (2) The assembly and welding can be localized by the magnetic film. However, a global wafer level process can be achieved by the magnetic field. (3) It is easy to tune the heating temperature by varying the area of the magnetic film; in other words, photolithography can define various temperature regions on a substrate.