Grain boundary diffusion and segregation of Ni in Cu

Grain boundary (GB) diffusion of 63Ni in polycrystalline Cu was investigated by the radiotracer technique in an extended temperature interval from 476 to 1156 K. The independent measurements in Harrison’s C and B kinetic regimes resulted in direct data of the GB diffusivity D gb and of the so-called...

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Bibliographic Details
Published in:Acta materialia 2007-06, Vol.55 (10), p.3337-3346
Main Authors: Divinski, Sergiy, Ribbe, Jens, Schmitz, Guido, Herzig, Christian
Format: Article
Language:English
Subjects:
Activation
Applied sciences
Copper
Diffusion
Diffusivity
Enthalpy
Exact sciences and technology
Grain boundaries
Grain boundary diffusion of nickel
Grain boundary segregation of nickel
Metals. Metallurgy
Nickel
Segregations
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Summary:Grain boundary (GB) diffusion of 63Ni in polycrystalline Cu was investigated by the radiotracer technique in an extended temperature interval from 476 to 1156 K. The independent measurements in Harrison’s C and B kinetic regimes resulted in direct data of the GB diffusivity D gb and of the so-called triple product P = s · δ · D gb ( s and δ are the segregation factor and the diffusional GB width, respectively). Arrhenius-type temperature dependencies for both the D gb and P values were measured, resulting in the pre-exponential factors D gb 0 = 6.93 × 10 - 7 m 2 s −1 and P 0 = 1.89 × 10 −16 m 3 s −1 and the activation enthalpies of 90.4 and 73.8 kJ mol −1, respectively. Although Ni is completely soluble in Cu, it reveals a distinct but still moderate ability to segregate copper GBs with a segregation enthalpy of about −17 kJ mol −1.
ISSN:1359-6454
1873-2453
DOI:10.1016/j.actamat.2007.01.032