Ratchetting and Creep Deformation of Solder Alloys

This paper conducts both experiments and numerical simulations of viscoplastic deformation such as creep and uniaxial ratcheting deformation of solder alloys used for electronic packaging. The correlation between creep and uniaxial ratchetting deformation is firstly discussed to establish the differ...

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Bibliographic Details
Published in:Key engineering materials 2007-06, Vol.340-341, p.859-864
Main Authors: Narita, Yoshihiro, Kobayashi, Takuji, Sasakir, Katsuhiko, Ohguchi, Ken-Ichi
Format: Article
Language:English
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Summary:This paper conducts both experiments and numerical simulations of viscoplastic deformation such as creep and uniaxial ratcheting deformation of solder alloys used for electronic packaging. The correlation between creep and uniaxial ratchetting deformation is firstly discussed to establish the differences in the time-dependent deformation of lead-free and lead-containing solder alloys. Numerical simulations are also carried out using the dislocation based constitutive model. Finally, the effect of the dislocation density on the viscoplastic deformation is discussed.
ISSN:1013-9826
1662-9795
1662-9795
DOI:10.4028/www.scientific.net/KEM.340-341.859