Wetting behaviour and reactivity of lead free Au–In–Sn and Bi–In–Sn alloys on copper substrates

The main objective of this work is to determine the wetting behaviour of lead-free solders on copper substrates in view of their applications in electronic industry. The wetting behaviour of X–In–Sn (X=Au, Bi) ternary molten alloys in contact with copper has been studied and compared with the corres...

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Bibliographic Details
Published in:International journal of adhesion and adhesives 2007-07, Vol.27 (5), p.409-416
Main Authors: Gnecco, F., Ricci, E., Amore, S., Giuranno, D., Borzone, G., Zanicchi, G., Novakovic, R.
Format: Article
Language:English
Subjects:
Applied sciences
Brazing. Soldering
Condensed matter: structure, mechanical and thermal properties
Contact angles
Exact sciences and technology
Interfaces
Joining, thermal cutting: metallurgical aspects
Lead-free solder alloys
Metals
Metals. Metallurgy
Physics
Solid-fluid interfaces
Surfaces and interfaces
thin films and whiskers (structure and nonelectronic properties)
Wetting
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Summary:The main objective of this work is to determine the wetting behaviour of lead-free solders on copper substrates in view of their applications in electronic industry. The wetting behaviour of X–In–Sn (X=Au, Bi) ternary molten alloys in contact with copper has been studied and compared with the corresponding behaviour of their binary subsystems with a particular attention to the In–Sn/Cu system. The contact angle measurements on Cu-plates were performed by using a sessile drop apparatus. The solder/copper interface was characterised by the SEM-EDS analysis.
ISSN:0143-7496
1879-0127
DOI:10.1016/j.ijadhadh.2006.09.008