Physical origin of spontaneous interfacial alloying in immiscible W/Cu multilayers

A metastable solid solution has been observed in immiscible W/Cu multilayers sputter deposited with very low period (≤3 nm). A recent model evidencing size dependence of surface energies and diffusion coefficients in bilayers may explain the observed trends since diffusion coefficients highly increa...

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Bibliographic Details
Published in:Journal of materials science 2007-09, Vol.42 (17), p.7446-7450
Main Authors: Villain, Pascale, Goudeau, Philippe, Badawi, Frederic, Ouyang, G, Yang, G. W, Pélosin, Véronique
Format: Article
Language:English
Subjects:
ALLOYING
Bilayers
Condensed matter: structure, mechanical and thermal properties
Copper
Dependence
DEPOSITION
Diffusion coefficient
DIFFUSION COEFFICIENTS
Diffusion layers
Diffusion
interface formation
diffusivity
Exact sciences and technology
Implantation
INTERFACES
INTERLAYERS
Materials science
Miscibility
mixing
Multilayers
Physics
SOLID SOLUTIONS
Solid surfaces and solid-solid interfaces
Surfaces and interfaces
thin films and whiskers (structure and nonelectronic properties)
Thickness
TUNGSTEN ALLOYS (50 TO 99 W)
Tungsten base alloys
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Summary:A metastable solid solution has been observed in immiscible W/Cu multilayers sputter deposited with very low period (≤3 nm). A recent model evidencing size dependence of surface energies and diffusion coefficients in bilayers may explain the observed trends since diffusion coefficients highly increase when layer thickness decreases. Furthermore, implantation effects of the energetic incoming atoms during layer deposition undoubtedly reinforce these mixing phenomena.
ISSN:0022-2461
1573-4803
DOI:10.1007/s10853-007-1605-y