Diffusion and segregation of substrate copper in electrodeposited Ni–Fe thin films

• Published in: Journal of alloys and compounds 2007-09, Vol.443 (1), p.81-86
• Main Authors: Ahadian, M.M., zad, A. Iraji, Nouri, E., Ranjbar, M., Dolati, A.
• Format: Article
• Language: English
• Subjects: Copper; Cross-disciplinary physics: materials science; rheology; Diffusion; Electrodeposition; Electrodeposition, electroplating; Exact sciences and technology; Materials science; Methods of deposition of films and coatings; film growth and epitaxy; Ni–Fe; Physics; Surface segregation
• ISSN: 0925-8388; 1873-4669
• DOI: 10.1016/j.jallcom.2006.10.048

The Cu surface segregation is investigated in the electrodeposited Ni–Fe layers using X-ray photoelectron spectroscopy (XPS), Auger electron spectroscopy (AES), secondary ion mass spectroscopy (SIMS) and atomic force microscopy (AFM). The results indicate that Cu segregation and accumulation take place in areated and deareated baths and the amount of segregated copper increases after air exposure. This phenomenon is explained by lower interfacial tension of the Cu in comparison with Ni and Fe. Our results reveal more surface segregation in the electrodeposit than vacuum reported results. This should be due to interface charging and higher surface diffusion in applied potential. The effect of interface charging on the interfacial tension is discussed based on Lippmann equation. Increasing of the Cu accumulation after air exposure is related to selective oxidation in alloys and higher tendency of Cu to surface oxidation.