Spacing defects and disconnections in grain boundaries

The process of cutting of a grain boundary by a gliding or climbing dislocation is considered. Some planar dislocation arrays with long-range stress fields are also treated. Defects formed on the grain boundaries by these mechanisms include edge and screw disconnections, grain boundary dislocations,...

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Bibliographic Details
Published in:Acta materialia 2007-09, Vol.55 (16), p.5428-5437
Main Authors: Hirth, J.P., Pond, R.C., Lothe, J.
Format: Article
Language:English
Subjects:
Applied sciences
Arrays
Crystal defects
Cutting
Disclinations
Disengaging
Dislocation jogs
Dislocations
Exact sciences and technology
Grain boundaries
Grain boundary defects
Line forces
Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology
Metals. Metallurgy
Plastic deformation
Topography
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Summary:The process of cutting of a grain boundary by a gliding or climbing dislocation is considered. Some planar dislocation arrays with long-range stress fields are also treated. Defects formed on the grain boundaries by these mechanisms include edge and screw disconnections, grain boundary dislocations, spacing defects and line forces. The cutting defects can also acquire kinks and jogs. The results have implications for emission of lattice dislocations from grain boundaries, trapping of dislocations at grain boundaries and grain boundary topography.
ISSN:1359-6454
1873-2453
DOI:10.1016/j.actamat.2007.06.004