LTCC MATERIAL WITH LOW TEMPERATURE COEFFICIENT OF RESONANCE FREQUENCY

For high frequency packaging applications, LTCC materials are required to have a low loss tangent to reduce the total microwave loss. For multi-layered ceramic devices with embedded passive components, besides a loss tangent, a small temperature coefficient of resonant frequency (TFC) is an importan...

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Published in:Key engineering materials 2005-01, p.105-108
Main Authors: Iwao, M, Umayahara, Y, Shindo, K
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description For high frequency packaging applications, LTCC materials are required to have a low loss tangent to reduce the total microwave loss. For multi-layered ceramic devices with embedded passive components, besides a loss tangent, a small temperature coefficient of resonant frequency (TFC) is an important factor. To meet these demands, a new LTCC material with a smaller TCF, less than plus or minus 3 ppm/C, and a low loss tangent, 0.0012 at 15 GHz was developed. The glass composition was designed in such a way as to precipitate two low-loss crystal phases during firing at 900 C. One phase has a plus TCF and the other phase has a minus TCF. The amount of the two crystal phases was also controlled and the fixed amount of alumina filler make the sum of TCF for the LTCC material close to zero. 4 refs.
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fullrecord <record><control><sourceid>proquest</sourceid><recordid>TN_cdi_proquest_miscellaneous_30110836</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>30110836</sourcerecordid><originalsourceid>FETCH-proquest_miscellaneous_301108363</originalsourceid><addsrcrecordid>eNqNyrsKwjAUANAMCtbHP9zJrZAYLHUM4YYG2kRjSnEqRSIo1aqx_-_iBzid5UxIwijj6S7fZDMyj_FGKWc52yYESy8lVMKj06KERvsCStuAx2qPTvjaIUiLSmmp0XiwChwerRFGIiiHhxqNPC3J9NL1Max-LshaoZdF-nwPrzHET3u_xnPo--4RhjG2nDJGc57xv-MXEcs2pQ</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>30110836</pqid></control><display><type>article</type><title>LTCC MATERIAL WITH LOW TEMPERATURE COEFFICIENT OF RESONANCE FREQUENCY</title><source>Scientific.net Journals</source><creator>Iwao, M ; Umayahara, Y ; Shindo, K</creator><creatorcontrib>Iwao, M ; Umayahara, Y ; Shindo, K</creatorcontrib><description>For high frequency packaging applications, LTCC materials are required to have a low loss tangent to reduce the total microwave loss. For multi-layered ceramic devices with embedded passive components, besides a loss tangent, a small temperature coefficient of resonant frequency (TFC) is an important factor. To meet these demands, a new LTCC material with a smaller TCF, less than plus or minus 3 ppm/C, and a low loss tangent, 0.0012 at 15 GHz was developed. The glass composition was designed in such a way as to precipitate two low-loss crystal phases during firing at 900 C. One phase has a plus TCF and the other phase has a minus TCF. The amount of the two crystal phases was also controlled and the fixed amount of alumina filler make the sum of TCF for the LTCC material close to zero. 4 refs.</description><identifier>ISSN: 1013-9826</identifier><language>eng</language><ispartof>Key engineering materials, 2005-01, p.105-108</ispartof><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784</link.rule.ids></links><search><creatorcontrib>Iwao, M</creatorcontrib><creatorcontrib>Umayahara, Y</creatorcontrib><creatorcontrib>Shindo, K</creatorcontrib><title>LTCC MATERIAL WITH LOW TEMPERATURE COEFFICIENT OF RESONANCE FREQUENCY</title><title>Key engineering materials</title><description>For high frequency packaging applications, LTCC materials are required to have a low loss tangent to reduce the total microwave loss. For multi-layered ceramic devices with embedded passive components, besides a loss tangent, a small temperature coefficient of resonant frequency (TFC) is an important factor. To meet these demands, a new LTCC material with a smaller TCF, less than plus or minus 3 ppm/C, and a low loss tangent, 0.0012 at 15 GHz was developed. The glass composition was designed in such a way as to precipitate two low-loss crystal phases during firing at 900 C. One phase has a plus TCF and the other phase has a minus TCF. The amount of the two crystal phases was also controlled and the fixed amount of alumina filler make the sum of TCF for the LTCC material close to zero. 4 refs.</description><issn>1013-9826</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2005</creationdate><recordtype>article</recordtype><recordid>eNqNyrsKwjAUANAMCtbHP9zJrZAYLHUM4YYG2kRjSnEqRSIo1aqx_-_iBzid5UxIwijj6S7fZDMyj_FGKWc52yYESy8lVMKj06KERvsCStuAx2qPTvjaIUiLSmmp0XiwChwerRFGIiiHhxqNPC3J9NL1Max-LshaoZdF-nwPrzHET3u_xnPo--4RhjG2nDJGc57xv-MXEcs2pQ</recordid><startdate>20050101</startdate><enddate>20050101</enddate><creator>Iwao, M</creator><creator>Umayahara, Y</creator><creator>Shindo, K</creator><scope>7QF</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20050101</creationdate><title>LTCC MATERIAL WITH LOW TEMPERATURE COEFFICIENT OF RESONANCE FREQUENCY</title><author>Iwao, M ; Umayahara, Y ; Shindo, K</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-proquest_miscellaneous_301108363</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2005</creationdate><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Iwao, M</creatorcontrib><creatorcontrib>Umayahara, Y</creatorcontrib><creatorcontrib>Shindo, K</creatorcontrib><collection>Aluminium Industry Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Key engineering materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Iwao, M</au><au>Umayahara, Y</au><au>Shindo, K</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>LTCC MATERIAL WITH LOW TEMPERATURE COEFFICIENT OF RESONANCE FREQUENCY</atitle><jtitle>Key engineering materials</jtitle><date>2005-01-01</date><risdate>2005</risdate><spage>105</spage><epage>108</epage><pages>105-108</pages><issn>1013-9826</issn><abstract>For high frequency packaging applications, LTCC materials are required to have a low loss tangent to reduce the total microwave loss. For multi-layered ceramic devices with embedded passive components, besides a loss tangent, a small temperature coefficient of resonant frequency (TFC) is an important factor. To meet these demands, a new LTCC material with a smaller TCF, less than plus or minus 3 ppm/C, and a low loss tangent, 0.0012 at 15 GHz was developed. The glass composition was designed in such a way as to precipitate two low-loss crystal phases during firing at 900 C. One phase has a plus TCF and the other phase has a minus TCF. The amount of the two crystal phases was also controlled and the fixed amount of alumina filler make the sum of TCF for the LTCC material close to zero. 4 refs.</abstract></addata></record>
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url http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-07T15%3A32%3A23IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=LTCC%20MATERIAL%20WITH%20LOW%20TEMPERATURE%20COEFFICIENT%20OF%20RESONANCE%20FREQUENCY&rft.jtitle=Key%20engineering%20materials&rft.au=Iwao,%20M&rft.date=2005-01-01&rft.spage=105&rft.epage=108&rft.pages=105-108&rft.issn=1013-9826&rft_id=info:doi/&rft_dat=%3Cproquest%3E30110836%3C/proquest%3E%3Cgrp_id%3Ecdi_FETCH-proquest_miscellaneous_301108363%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_pqid=30110836&rft_id=info:pmid/&rfr_iscdi=true