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Recent advances on outstanding microwave absorption and electromagnetic interference shielding nanocomposites of ZnO semiconductor

The electromagnetic interference shielding and microwave attenuation capabilities of ZnO semiconductor nanocomposites have recently been improved using a variety of approaches by correctly modifying their permittivity. To improve microwave attenuation, ZnO semiconductor nanostructures have been comb...

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Published in:Advances in colloid and interface science 2024-04, Vol.326, p.103137-103137, Article 103137
Main Authors: Yadav, Raghvendra Singh, Kuřitka, Ivo
Format: Article
Language:English
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Summary:The electromagnetic interference shielding and microwave attenuation capabilities of ZnO semiconductor nanocomposites have recently been improved using a variety of approaches by correctly modifying their permittivity. To improve microwave attenuation, ZnO semiconductor nanostructures have been combined with graphene, multi-wall carbon nanotubes, metal nanoparticles and their alloys, two-dimensional MXene, spinel ferrite magnetic nanoparticles, polymer systems, and textiles. This paper covers the opportunities and constraints that these cutting-edge nanocomposites in the field of electromagnetic wave absorption encounter as well as the research progress of ZnO semiconductor-based nanocomposite. The structure-function relationship of electromagnetic wave absorption nanocomposites, design strategies, synthesis techniques, and various types of advanced nanocomposites based on ZnO semiconductor are also covered. In order to design and prepare high efficiency ZnO semiconductor based electromagnetic wave absorbing materials for use in applications of next-generation electronics and aerospace, this article can offer some useful ideas. [Display omitted] •Various Nanocomposites of ZnO semiconductors are reviewed in detail.•EMI shielding and microwave absorption mechanisms are discussed.•The challenges and potential directions of ZnO nanocomposites are addressed.
ISSN:0001-8686
1873-3727
DOI:10.1016/j.cis.2024.103137