Effect of Microstructure on the Tribological and Mechanical Properties of CuO-Doped 3Y-TZP Ceramics

• Published in: Journal of the American Ceramic Society 2007-09, Vol.90 (9), p.2747-2752
• Main Authors: Ran, Shen, Winnubst, Louis, Blank, Dave H. A., Pasaribu, Henry R., Sloetjes, Jan-Willem, Schipper, Dik J.
• Format: Article
• Language: English
• Subjects: Applied sciences; BOUNDARIES; Building materials. Ceramics. Glasses; Ceramic industries; Ceramic sintering; CERAMICS; Chemical industry and chemicals; COPPER OXIDE; DOPING; Exact sciences and technology; GRAIN BOUNDARIES; Materials science; MECHANICAL PROPERTIES; Microstructure; MICROSTRUCTURES; Miscellaneous; PROPERTIES; SINTERING; Technical ceramics; Tetragonal zirconia polycrystals; TRIBOLOGY; Yttria stabilized zirconia
• ISSN: 0002-7820; 1551-2916
• DOI: 10.1111/j.1551-2916.2007.01823.x

Dense 8 mol% CuO‐doped 3Y‐TZP ceramics were prepared by pressureless sintering for 8 h at 1500° and 1550°C, respectively. Transmission electron spectroscopy revealed that the ceramic sintered at 1500°C exhibits grain boundaries free of any amorphous phase, while crystalline copper‐oxide grains were found in the zirconia matrix, whereas the sample sintered at 1550°C contains a Cu‐rich amorphous grain boundary layer. The tribological behavior of these materials was tested under dry‐sliding conditions using a pin‐on‐disk tribometer. The material sintered at 1500°C showed self‐lubrication resulting in a low coefficient of friction (f) of 0.2–0.3 and a low specific wear rate (k) ≪ 10−6 mm3·(N·m)−1. In contrast, the material sintered at 1550°C showed poor tribological behavior (f=0.8–0.9; k≫ 10−6 mm3·(N·m)−1 under the same conditions. The difference in the tribological behavior of these two materials was interpreted on the basis of mechanical properties and microstructural characteristics.