Distributed temperature sensing on silicon-on-insulator chip by optical frequency domain reflectometry

This study introduces a novel distributed temperature sensing (DTS) technique on silicon-on-insulator (SOI) chips by the optical frequency domain reflectometry (OFDR) technology. In contrast to traditional on-chip silicon photonics temperature sensors which rely on transmission spectrum detection, t...

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Bibliographic Details
Published in:Optics express 2024-07, Vol.32 (15), p.25519
Main Authors: Kong, Degangao, Chen, Cheng, Zhao, Xianmeng, Tao, Yifei, Wan, Jiajun, Wen, Yongqiang, Zhang, Xiaolei, Yuan, Sujun, Liu, Xiaoping
Format: Article
Language:English
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Summary:This study introduces a novel distributed temperature sensing (DTS) technique on silicon-on-insulator (SOI) chips by the optical frequency domain reflectometry (OFDR) technology. In contrast to traditional on-chip silicon photonics temperature sensors which rely on transmission spectrum detection, this method is based on Rayleigh backscatter induced by the sidewall roughness of as-fabricated waveguides, eliminating the need for a specially designed structure. On-chip DTS results with a remarkable sensing spatial resolution of 200 m and a high temperature sensitivity of 88 pm/K are demonstrated within the temperature range from 22.8  C to 200 C. Furthermore, the technology is employed to measure non-uniform temperature distributions along an SOI waveguide generated by integrated heaters. Importantly, this approach offers a straightforward sensing structure, opening new possibilities for investigating temperature profiles and thermal crosstalk across the chip.
ISSN:1094-4087
1094-4087
DOI:10.1364/OE.511964