SIMULTANEOUS NON-CONTACT PRECISION IMAGING OF MICROSTRUCTUAL AND THICKNESS VARIATION IN DIELECTRIC MATERIALS USING TERAHERTZ ENERGY

This article describes a non-contact single-sided terahertz electromagnetic measurement and imaging method that simultaneously characterizes microstructural (e.g. spatially-lateral density) and thickness variation in dielectric (insulating) materials. The method was demonstrated for Space Shuttle Ex...

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Bibliographic Details
Main Authors: Roth, D J, Seebo, J P, Winfree, William P
Format: Conference Proceeding
Language:English
Online Access:Get full text
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Summary:This article describes a non-contact single-sided terahertz electromagnetic measurement and imaging method that simultaneously characterizes microstructural (e.g. spatially-lateral density) and thickness variation in dielectric (insulating) materials. The method was demonstrated for Space Shuttle External Tank sprayed-on foam insulation. It is believed that this method can be used for applications where microstructural and/or thickness variation in dielectric materials require precision mapping. Scale-up to more complex shapes such as cylindrical structures and structures with beveled regions would appear to be feasible.
ISSN:0094-243X
DOI:10.1063/1.2902692