Microstructure and properties of polyamideimide/silica hybrids compatibilized with 3-aminopropyltriethoxysilane

In this work, we prepared and characterized polyamideimide (PAI)/silica hybrids compatibilized with 3-aminopropyltriethoxysilane (APTES). PAI/silica nanohybrid thin films were prepared using an in situ sol–gel process, followed by thermal imidization. We have investigated the microstructures and pro...

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Bibliographic Details
Published in:European polymer journal 2008-07, Vol.44 (7), p.2236-2243
Main Authors: Son, Minsoo, Ha, Youri, Choi, Myeon-Cheon, Lee, Taesung, Han, Donghee, Han, Sewon, Ha, Chang-Sik
Format: Article
Language:English
Subjects:
Applied sciences
Compatibilized
Composites
Exact sciences and technology
Forms of application and semi-finished materials
Hybrid
Microstructure
Polyamideimide
Polymer industry, paints, wood
Silica
Technology of polymers
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Summary:In this work, we prepared and characterized polyamideimide (PAI)/silica hybrids compatibilized with 3-aminopropyltriethoxysilane (APTES). PAI/silica nanohybrid thin films were prepared using an in situ sol–gel process, followed by thermal imidization. We have investigated the microstructures and properties of the PAI/silica hybrids using FT-IR spectroscopy, X-ray diffraction, small-angle X-ray scattering (SAXS), and differential scanning calorimetry (DSC). We also measured their tensile properties, thermal properties, refractive indices, and dielectric constants. In general, the properties of the PAI/silica hybrids were optimized when the silica content was 6 wt.%.
ISSN:0014-3057
1873-1945
DOI:10.1016/j.eurpolymj.2008.04.037