Optimal conditions for the wetting balance test

Wetting balance tests of copper sheets submerged in tin solder baths were carried out in a completely automatic wetting balance. Wetting curves were examined for three different values of sheet thickness and four different solder bath temperatures. Most of the wetting curves showed a distorted shape...

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Bibliographic Details
Published in:Journal of materials processing technology 2009-03, Vol.209 (6), p.3089-3095
Main Authors: Martorano, K.M., Martorano, M.A., Brandi, S.D.
Format: Article
Language:English
Subjects:
Soldering
Spreading
Wetting balance
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Summary:Wetting balance tests of copper sheets submerged in tin solder baths were carried out in a completely automatic wetting balance. Wetting curves were examined for three different values of sheet thickness and four different solder bath temperatures. Most of the wetting curves showed a distorted shape relative to that of a standard curve, preventing calculation of important wetting parameters, such as the wetting rate and the wetting force. The wetting tests showed that the distortion increased for a thicker sheet thickness and a lower solder bath temperature, being the result of solder bath solidification around the submerged sheet substrate.
ISSN:0924-0136
DOI:10.1016/j.jmatprotec.2008.07.015