Characterization of electroplated, thick permalloy films

Permalloy (Ni81Fe19) films and foils were fabricated by means of electroplating. Two different types of samples were produced, (i) a patterned permalloy film on a Si wafer (type 1) and (ii) a NiFe foil (type 2), which was separated from the substrate after deposition. The samples were characterized...

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Bibliographic Details
Published in:Physica status solidi. A, Applications and materials science Applications and materials science, 2008-08, Vol.205 (8), p.1809-1812
Main Authors: Getlawi, S., Theis, M., Friedrich, S., Koblischka-Veneva, A., Koblischka, M. R., Saumer, M., Hartmann, U.
Format: Article
Language:English
Subjects:
75.50.Bb
81.15.Pq
Condensed matter: structure, mechanical and thermal properties
Exact sciences and technology
Physics
Structure and morphology
thickness
Surfaces and interfaces
thin films and whiskers (structure and nonelectronic properties)
Thin film structure and morphology
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Summary:Permalloy (Ni81Fe19) films and foils were fabricated by means of electroplating. Two different types of samples were produced, (i) a patterned permalloy film on a Si wafer (type 1) and (ii) a NiFe foil (type 2), which was separated from the substrate after deposition. The samples were characterized employing magnetic force microscopy (MFM), transmission electron microscopy (TEM) and electron‐backscatter diffraction (EBSD). On the foil type sample, MFM reveals a maze domain pattern, and on the structured samples (type 1), a Landau domain pattern is obtained. EBSD enables the identification of the permalloy Kikuchi pattern without the effect of a substrate. The analysis reveals randomly oriented grains with a narrow size distribution. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)
ISSN:1862-6300
0031-8965
1862-6319
DOI:10.1002/pssa.200723621