Modeling Thermal Process in a Resistive Element of a Fault Current Limiter

The thermal regime of the Ni tape immersed into liquid nitrogen and heated up due to Joule losses generated by a step-like direct current is studied experimentally and theoretically. The temporal dependence of the temperature rise in Ni tape is measured. An adiabatic approach is shown to give a cons...

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Bibliographic Details
Published in:IEEE transactions on applied superconductivity 2008-03, Vol.18 (1), p.7-13
Main Authors: Dul'kin, I.N., Yevsin, D.V., Fisher, L.M., Ivanov, V.P., Kalinov, A.V., Sidorov, V.A.
Format: Article
Language:English
Subjects:
Conducting materials
Conduction heating
Current limiters
DC generators
Fault current limiters
Faults
Heat transfer
Liquid nitrogen
Nickel
Nitrogen
resistive fault current limiter
Superconducting films
Superconducting materials
Superconducting tapes
Superconductivity
Temperature dependence
Temporal logic
thermal conduction
Thermal conductivity
Thermal resistance
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Summary:The thermal regime of the Ni tape immersed into liquid nitrogen and heated up due to Joule losses generated by a step-like direct current is studied experimentally and theoretically. The temporal dependence of the temperature rise in Ni tape is measured. An adiabatic approach is shown to give a conservative result. According to our results, taking into account the heat transfer by thermal conduction into liquid nitrogen is necessary. This circumstance allows one to reduce a significantly necessary amount of high-temperature-superconductor material for the superconducting part of a resistive fault current limiter.
ISSN:1051-8223
1558-2515
DOI:10.1109/TASC.2008.917544