Prevention of Boundary Image Sticking in an AC Plasma Display Panel Using a Vacuum Sealing Process

• Published in: IEEE transactions on electron devices 2008-06, Vol.55 (6), p.1345-1351
• Main Authors: PARK, Choon-Sang, TAE, Heung-Sik, KWON, Young-Kuk, EUN GI HEO, LEE, Byung-Hak
• Format: Article
• Language: English
• Subjects: 42-in ac plasma display panel (ac-PDP) module; Applied sciences; Atmospheric pressure sealing process; Boundaries; boundary image sticking; Devices; Display; Electronics; Exact sciences and technology; focused ion beam (FIB); hbox{O}_{2} or hbox{N}_{2} flow; Impurities; impurity gas; Instruments, apparatus, components and techniques common to several branches of physics and astronomy; MgO hardness; MgO sputtering rate; Microelectronic fabrication (materials and surfaces technology); nanoindentor; Panels; Physics; scanning electron microscope (SEM); Scanning probe microscopes, components and techniques; Sealing; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; time-of-flight secondary ion mass spectrometry (TOF-SIMS); vacuum sealing process
• ISSN: 0018-9383; 1557-9646
• DOI: 10.1109/TED.2008.921986

Boundary image sticking can be inherently prevented in an ac plasma display panel fabricated using a vacuum sealing process. The results indicate that residual impurities, such as nitrogen or oxygen, are essentially related to the production of boundary image sticking. When checking the production of boundary image sticking in a test panel fabricated using a or an flow during the vacuum sealing process, no boundary image sticking appeared in the case of a flow, whereas boundary image sticking was produced with an flow, although the test panel was fabricated using a vacuum sealing process. Consequently, reducing the residual impurity, particularly oxygen, based on a vacuum sealing process can inherently prevent boundary image sticking.