Modeling Multiple Vias With Arbitrary Shape of Antipads and Pads in High Speed Interconnect Circuits

This letter successfully extends the full-wave semi-analytical approach, based on Foldy-Lax multiple scattering equations and modal expansions, to solve massively-coupled multiple vias with arbitrary shape of antipads and pads in high speed interconnect circuits. The magnetic frill current at the an...

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Bibliographic Details
Published in:IEEE microwave and wireless components letters 2009-01, Vol.19 (1), p.12-14
Main Authors: Boping Wu, Boping Wu, Leung Tsang, Leung Tsang
Format: Article
Language:English
Subjects:
Apertures
Applied sciences
Arrays
Circuits
Design. Technologies. Operation analysis. Testing
Drilling
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Equations
Equivalent circuits
Exact sciences and technology
Finite difference method
Finite difference methods
Foldy-Lax equation
High speed
high-speed interconnects
Integrated circuit interconnections
Integrated circuits
Mathematical analysis
Mathematical models
Matrix decomposition
Microwaves
printed circuit boards (PCBs)
Scattering
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Shape
signal integrity
Transmission line matrix methods
via connections
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Summary:This letter successfully extends the full-wave semi-analytical approach, based on Foldy-Lax multiple scattering equations and modal expansions, to solve massively-coupled multiple vias with arbitrary shape of antipads and pads in high speed interconnect circuits. The magnetic frill current at the antipad aperture is calculated using finite difference method. Numerical examples of as many as 16-by-16 via array demonstrate that this approach is able to model the multiple vias problem at about five thousand times faster than Ansoft HFSS and yet is within 5% difference of accuracy up to 20 GHz.
ISSN:1531-1309
2771-957X
1558-1764
2771-9588
DOI:10.1109/LMWC.2008.2008532