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Scalable Model of Substrate Resistance Components in RF MOSFETs With Bar-Type Body Contact Considered Layout Dimensions
Scalable model of substrate resistance components for radio-frequency MOSFETs fabricated by 65-nm CMOS technology with the bar-type body contact set in a horizontal direction to gate poly is presented. We consider various layout dimensions, such as channel length; unit finger width; number of finger...
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Published in: | IEEE electron device letters 2009-04, Vol.30 (4), p.404-406 |
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Main Authors: | , , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | Scalable model of substrate resistance components for radio-frequency MOSFETs fabricated by 65-nm CMOS technology with the bar-type body contact set in a horizontal direction to gate poly is presented. We consider various layout dimensions, such as channel length; unit finger width; number of fingers; distance between body contact and active region; and gate poly to gate poly distance on substrate resistance modeling. By using our model, the output admittance of the MOSFETs is well matched up to 50 GHz. The proposed models for substrate resistance are more accurate for devices with various geometries than previous substrate resistance models. |
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ISSN: | 0741-3106 1558-0563 |
DOI: | 10.1109/LED.2009.2014085 |