Analytical Model for Optimum Signal Integrity in PCB Interconnects Using Ground Tracks

In this paper, we present analytical models for line impedance and the coupling coefficient in the presence of additional ground tracks. We use a variational analysis combined with the transverse transmission-line technique to model interconnect lines guarded by ground tracks. Using the proposed mod...

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Bibliographic Details
Published in:IEEE transactions on electromagnetic compatibility 2009-02, Vol.51 (1), p.67-77
Main Authors: Sharma, R., Chakravarty, T., Bhattacharyya, A.B.
Format: Article
Language:English
Subjects:
Analytical models
Applied sciences
Couplings
Crosstalk
Design. Technologies. Operation analysis. Testing
Electromagnetic compatibility
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Exact sciences and technology
finite-difference time-domain (FDTD)
Ground tracks
High speed
Impedance
Integrated circuits
Mathematical analysis
Optimization
printed circuit board (PCB) interconnects
Printed circuits
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Signal integrity
Transmission lines
variational analysis
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Summary:In this paper, we present analytical models for line impedance and the coupling coefficient in the presence of additional ground tracks. We use a variational analysis combined with the transverse transmission-line technique to model interconnect lines guarded by ground tracks. Using the proposed model, it would be possible for designers to reduce crosstalk in coupled lines and obtain desired line impedance, thereby ensuring optimum signal integrity. The results obtained are verified by full-wave simulations and measurements performed on a vector network analyzer. The proposed model may find applications in the design and analysis of high-speed interconnects.
ISSN:0018-9375
1558-187X
DOI:10.1109/TEMC.2008.2010054